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Specific Process Knowledge/Thin film deposition/Deposition of Silicon Nitride/Deposition of Silicon Nitride using PECVD: Difference between revisions

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DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, Bureaucrats, Administrators
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Bghe (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, Bureaucrats, Administrators
7,324 edits
Line 150: Line 150:
|Power [W]
|Power [W]
|Description
|Description
|-
|MFSiNLS2
|30
|30
|1470
|845
|100HF 7.8s
100LF 2.2s
|Low stress nitride - standard recipe. The latest measured values can be seen in the process control sheet in LabManager.
|-  
|-  
|MFSiNLS
|MFSiNLS
Line 158: Line 168:
|20HF 6s  
|20HF 6s  
30LF 2s
30LF 2s
|Low stress nitride - standard recipe. The latest measured values can be seen in the process control sheet in LabManager.
|Low stress nitride - old standard recipe. This one is not running well any more.
|-
|-
|LFSiN
|LFSiN
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