Specific Process Knowledge/Thin film deposition/Deposition of Silicon Nitride/Deposition of Silicon Nitride using PECVD: Difference between revisions
No edit summary |
|||
| Line 4: | Line 4: | ||
At the moment DANCHIP has 3 PECVDs that can deposite silicon nitride and silicon oxynitride. PECVD1 and PECVD3 are for silicon based processing. PECVD2 is for III-V processing and will be describes under III-V processing. Look at the [[Specific Process Knowledge/Thin film deposition/PECVD|PECVD]] page to learn more about the PECVDs at DANCHIP. All though PECVD1 and PECVD3 are very much alike you cannot count on the a recipe on one system will give exactly the same results on the other system. | At the moment DANCHIP has 3 PECVDs that can deposite silicon nitride and silicon oxynitride. PECVD1 and PECVD3 are for silicon based processing. PECVD2 is for III-V processing and will be describes under III-V processing. Look at the [[Specific Process Knowledge/Thin film deposition/PECVD|PECVD]] page to learn more about the PECVDs at DANCHIP. All though PECVD1 and PECVD3 are very much alike you cannot count on the a recipe on one system will give exactly the same results on the other system. | ||
==Recipes on | ==Recipes on PECVD2 for deposition of silicon nitride and silicon oxynitride [[Image:section under construction.jpg|70px]] == | ||
===Recipes=== | ===Recipes=== | ||
{| border="1" cellspacing="0" cellpadding="7" | {| border="1" cellspacing="0" cellpadding="7" | ||
| Line 62: | Line 62: | ||
|- | |- | ||
|} | |} | ||
==Recipes on PECVD3 for deposition of silicon nitride and silicon oxynitride== | ==Recipes on PECVD3 for deposition of silicon nitride and silicon oxynitride== | ||