Specific Process Knowledge/Thin film deposition/Deposition of Silicon Nitride/Deposition of Silicon Nitride using PECVD: Difference between revisions

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 ==Recipes on PECVD3 for deposition of silicon nitride and silicon oxynitride==
+{| border="1" cellspacing="2" cellpadding="2" colspan="3"
+|bgcolor="#98FB98" |'''Quality Controle (QC) for PECVD3'''
+|-
+|
+*[http://labmanager.danchip.dtu.dk/d4Show.php?id=1389&mach=18 The QC procedure for RIE1 and RIE2]<br>
+*[http://www.labmanager.danchip.dtu.dk/view_binary.php?type=data&mach=18 The newest QC data for RIE1]<br>
+*[http://www.labmanager.danchip.dtu.dk/view_binary.php?type=data&mach=19 The newest QC data for RIE2]
+{| {{table}}
+| align="center" |
+{| border="1" cellspacing="1" cellpadding="2"  align="center" style="width:200px"
+! QC Recipe:
+! QCNITRIDE
+|-
+| SiH<sub>4</sub> flow
+|30 sccm
+|-
+|NH<sub>3</sub> flow
+|30 sccm
+|-
+|N<sub>2</sub> flow
+|1470 sccm
+|-
+|Pressure
+|650 mTorr
+|-
+|RF-power
+|
+*LF: 20 W 2s
+*HF: 20 W 6s
+|-
+|}
+| align="center" valign="top"|
+{| border="2" cellspacing="1" cellpadding="2" align="center" style="width:500px"
+!QC limits
+!PECVD3
+|-
+|Depoition rate
+|? - ? nm/min
+|-
+|Non-uniformity
+|? - ? %
+|-
+|}
+|-
+|}
+|}
 ===Recipes===
 {| border="1" cellspacing="0" cellpadding="7"