Specific Process Knowledge/Thin film deposition/Deposition of Vanadium Silicide/V3Si RF-DC Co-Sputtering in Cluster Lesker PC3: Difference between revisions
Appearance
No edit summary |
|||
| (2 intermediate revisions by the same user not shown) | |||
| Line 5: | Line 5: | ||
=Exploratory V-Si RF-DC co-sputtering in Cluster Lesker PC3= | =Exploratory V-Si RF-DC co-sputtering in Cluster Lesker PC3= | ||
This page documents an early, non-systematic attempt to deposit vanadium silicide by simultaneous RF sputtering of a 4-inch Si target and DC sputtering of a 3-inch V target in the <i>Cluster Lesker PC3</i> chamber. Two otherwise nominally identical depositions were compared: one without RF substrate bias and one with 30 W RF substrate bias. | This page documents an <b>early</b>, <b>non-systematic attempt</b> to deposit vanadium silicide by simultaneous RF sputtering of a 4-inch Si target and DC sputtering of a 3-inch V target in the <i>Cluster Lesker PC3</i> chamber. Two otherwise nominally identical depositions were compared: one without RF substrate bias and one with 30 W RF substrate bias. | ||
We achieved the expected results for the V<sub>3</sub>Si process in PC1 and describe them [[Specific Process Knowledge/Thin film deposition/Deposition of Vanadium Silicide/V3Si RF-DC Co-Sputtering in Cluster Lesker PC1|in dedicated page]]. | |||
The experiment gave a striking result. In the measured 30–80° GiXRD range, the unbiased sample showed only reflections assigned to cubic A15 V<sub>3</sub>Si, whereas the sample deposited with 30 W RF substrate bias showed only reflections assigned to hexagonal C40 VSi<sub>2</sub>. The two samples also had very different surface morphologies and sheet resistances. | The experiment gave a striking result. In the measured 30–80° GiXRD range, the unbiased sample showed only reflections assigned to cubic A15 V<sub>3</sub>Si, whereas the sample deposited with 30 W RF substrate bias showed only reflections assigned to hexagonal C40 VSi<sub>2</sub>. The two samples also had very different surface morphologies and sheet resistances. | ||
| Line 177: | Line 179: | ||
! XRR density | ! XRR density | ||
! XRR roughness | ! XRR roughness | ||
|- | |- | ||
| No substrate bias | | No substrate bias | ||
| Line 186: | Line 187: | ||
| 4.741 g/cm<sup>3</sup> | | 4.741 g/cm<sup>3</sup> | ||
| 7.873 nm | | 7.873 nm | ||
|- | |- | ||
| 30 W RF substrate bias (69 V DC bias) | | 30 W RF substrate bias (69 V DC bias) | ||
| Line 195: | Line 195: | ||
| Not obtained | | Not obtained | ||
| Not obtained | | Not obtained | ||
|} | |} | ||