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Specific Process Knowledge/Thin film deposition/Deposition of Scandium Nitride/ScN Reactive Sputtering in Cluster Lesker PC3: Difference between revisions

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This page presents the results of Scandium Nitride deposition using <b>RF</b> Reactive Sputtering in Sputter-System Metal-Nitride (PC3) commonly known as "Cluster Lesker". The deposition target is 4" <b>Sc</b> (0.25" Indium bonded to Cu plate). Source #1 was used. Materials (ScN) from this source can either be deposited with RF or p-DC sputtering although only RF mode has been tested so far.  
This page presents the results of Scandium Nitride deposition using <b>RF</b> Reactive Sputtering in Sputter-System Metal-Nitride (PC3) commonly known as "Cluster Lesker". The deposition target is 4" <b>Sc</b> (0.250" Indium bonded with indium to 3mm Cu plate). Source #1 was used. Materials (ScN) from this source can either be deposited with RF or p-DC sputtering although only RF mode has been tested so far.  




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Samples: 6" Si.
Samples: 6" Si without native oxide (HF-treated).


<gallery caption="The photography of Sc target mounted in 4” magnetron (PC3 Src1). "widths="400px" heights="500px" perrow="2">
<gallery caption="The photography of Sc target mounted in 4” magnetron (PC3 Src1). "widths="400px" heights="500px" perrow="2">
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[[Specific Process Knowledge/Characterization/XRD/XRD_SmartLab|X-ray Reflectivity]] analysis of ScN samples have been performed to investigate the thicknesses, roughness, and density profiles.  
[[Specific Process Knowledge/Characterization/XRD/XRD_SmartLab|X-ray Reflectivity]] analysis of ScN samples have been performed to investigate the thicknesses, roughness, and density profiles.  


The scans has been obtained using Rigaku XRD SmartLab equipment. The voltage and current settings for the Cu X-ray tube were standard  40kV and 30mA. The incident optics contained a IPS (incident parallel slit) adaptor with 5 &deg; Soller slit. Other slits: IS=0.05mm RS1=0.05mm and RS2=0.075mm. Step size: 0.01 and measurement time - 5s for each point. Fitting procesure was performed using commercial GlobalFit software assuming the model based on Si  substrate  followed by the deposited ScN film with thin oxides and moisture surfaces. The results are summarized in a tables below.
The scans has been obtained using Rigaku XRD SmartLab equipment. The voltage and current settings for the Cu X-ray tube were standard  40kV and 30mA. The incident optics contained a IPS (incident parallel slit) adaptor with 5 &deg; Soller slit. Other slits: IS=0.05mm RS1=0.05mm and RS2=0.075mm. Step size: 0.01 and measurement time - 5s for each point. Fitting procesure was performed using commercial GlobalFit software assuming the model based on Si  substrate  followed by Sc-Si transition layer for better fit, followed by the main ScN film with thin oxides and moisture surfaces. The results are summarized in a tables below.




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