Specific Process Knowledge/Thin film deposition/Deposition of TiW/Sputtering of TiW in Wordentec/Grain size and uniformity of TiW layers: Difference between revisions
Appearance
No edit summary |
mNo edit summary |
||
| Line 1: | Line 1: | ||
{{cc-nanolab}} | |||
'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Thin_film_deposition/Deposition_of_TiW/Sputtering_of_TiW_in_Wordentec/Grain_size_and_uniformity_of_TiW_layers click here]''' | '''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Thin_film_deposition/Deposition_of_TiW/Sputtering_of_TiW_in_Wordentec/Grain_size_and_uniformity_of_TiW_layers click here]''' | ||
==Grains and uniformity of a sputtered TiW film== | ==Grains and uniformity of a sputtered TiW film== | ||