Specific Process Knowledge/Thermal Process/Storage and cleaning of wafer to the A, B, C and E stack furnaces: Difference between revisions
No edit summary |
mNo edit summary |
||
| (2 intermediate revisions by 2 users not shown) | |||
| Line 1: | Line 1: | ||
{{cc-nanolab}} | |||
'''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Thermal_Process/Storage_and_cleaning_of_wafer_to_the_A,_B,_C_and_E_stack_furnaces click here]''' | '''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Thermal_Process/Storage_and_cleaning_of_wafer_to_the_A,_B,_C_and_E_stack_furnaces click here]''' | ||
| Line 26: | Line 28: | ||
====C2 furnace:==== | ====C2 furnace:==== | ||
*Dedicated for oxidation of III-V materials. More information can be found [[Specific_Process_Knowledge/Thermal_Process/C2_Furnace_III-V_oxidation | *Dedicated for oxidation of III-V materials. More information can be found [[Specific_Process_Knowledge/Thermal_Process/C2_Furnace_III-V_oxidation | here]]. | ||
====C3 furnace:==== | ====C3 furnace:==== | ||
| Line 36: | Line 38: | ||
====C4 furnace:==== | ====C4 furnace:==== | ||
*For annealing of wafers and wafer pieces with Al, Al2O3 and TiO2. The samples cannot be RCA cleaned. | *For annealing of wafers and wafer pieces with Al, Al2O3 and TiO2. The samples cannot be RCA cleaned. | ||
====E1 furnace:==== | |||
*New silicon wafers can go directly into the furnace. | |||
*Other processed wafers and new quartz wafers have to be RCA cleaned. The wafers can be cleaned the day before they are going into the furnace. | |||