LabAdviser/Technology Research/Nanofabrication of Inductive Components for Integrated Power Supply On Chip: Difference between revisions
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'''Feedback to this page''': '''[mailto:labadviser@ | '''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/LabAdviser/Technology_Research/Nanofabrication_of_Inductive_Components_for_Integrated_Power_Supply_On_Chip click here]''' | ||
=Nanofabrication of Inductive Components for Integrated Power Supply On Chip = | =Nanofabrication of Inductive Components for Integrated Power Supply On Chip = | ||
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*'''Project responsible:''' Hoà Lê Thanh | *'''Project responsible:''' Hoà Lê Thanh | ||
*'''Supervisors:''' Flemming Jensen (Main), Anpan Han (Co), Ziwei Ouyang (Co), Arnold Knott (CO) | *'''Supervisors:''' Flemming Jensen (Main), Anpan Han (Co), Ziwei Ouyang (Co), Arnold Knott (CO) | ||
*'''Partners involved:''' DTU Danchip, DTU Elektro | *'''Partners involved:''' DTU Nanolab (former DTU Danchip), DTU Elektro | ||
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'''Full thesis''': [[:File:1. A4size_HoaThanhLe_Thesis_14.12.2017.pdf]] | '''Full thesis''': [[:File:1. A4size_HoaThanhLe_Thesis_14.12.2017.pdf]] | ||
= | =Publications= | ||
[1] Hoa Thanh Le, Io Mizushima, Peter Torben Tang, Ziwei Ouyang, Flemming Jensen, and Anpan Han. “Fabrication of 3D Air-core MEMS Inductors for High Frequency Power Electronic Applications”. Microsystems & Nanoengineering, vol. 4, no. 17082, 2018. ([https://www.nature.com/articles/micronano201782.pdf]) | [1] Hoa Thanh Le, Io Mizushima, Peter Torben Tang, Ziwei Ouyang, Flemming Jensen, and Anpan Han. “Fabrication of 3D Air-core MEMS Inductors for High Frequency Power Electronic Applications”. Microsystems & Nanoengineering, vol. 4, no. 17082, 2018. ([https://www.nature.com/articles/micronano201782.pdf]) | ||
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configuration at both terminals for wafer-level probing. Four 800 µm by 800 µm pads at the corners are for flip-chip bonding. (b) 1:1 toroidal transformer. The primary coil has larger conductors than that of the secondary coil. (c) solenoid inductor, (d) spiral inductor, (e) "DTU" inductor. | configuration at both terminals for wafer-level probing. Four 800 µm by 800 µm pads at the corners are for flip-chip bonding. (b) 1:1 toroidal transformer. The primary coil has larger conductors than that of the secondary coil. (c) solenoid inductor, (d) spiral inductor, (e) "DTU" inductor. | ||
= | =Process Development= | ||
[[/Air-core Inductor|Air-core Inductor]] | [[/Air-core Inductor|Air-core Inductor]] | ||
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[[/3D Passive Interposer|3D Passive Interposer]] | [[/3D Passive Interposer|3D Passive Interposer]] | ||