LabAdviser/Technology Research/Organic Ice Resists for Electron-Beam Lithography - Instrumentation and Processes: Difference between revisions
mNo edit summary |
|||
| (6 intermediate revisions by 2 users not shown) | |||
| Line 1: | Line 1: | ||
'''Feedback to this page''': '''[mailto:labadviser@ | '''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/LabAdviser/Technology_Research/Ice_Lithography_for_Advanced_Nanofabrication click here]''' | ||
=Organic Ice Resists for Electron-Beam Lithography - Instrumentation and Processes= | =Organic Ice Resists for Electron-Beam Lithography - Instrumentation and Processes= | ||
| Line 5: | Line 5: | ||
*'''Project responsible:''' William Tiddi ([http://orbit.dtu.dk/en/persons/william-tiddi(7603153a-3652-4965-8e92-62b3a5deb499).html DTU Orbit]) | *'''Project responsible:''' William Tiddi ([http://orbit.dtu.dk/en/persons/william-tiddi(7603153a-3652-4965-8e92-62b3a5deb499).html DTU Orbit]) | ||
*'''Supervisors:''' Assoc. Prof. Marco Beleggia, Assist. Prof. Anpan Han | *'''Supervisors:''' Assoc. Prof. Marco Beleggia, Assist. Prof. Anpan Han | ||
*'''Partners involved:''' DTU Danchip/Cen | *'''Partners involved:''' DTU Nanolab (former DTU Danchip/DTU Cen) | ||
*'''Full thesis:''' [[:File:PhDthesisPapers_v2.pdf|Link]] | *'''Full thesis:''' [[:File:PhDthesisPapers_v2.pdf|Link]] | ||
*'''Overview:''' [[/Electron-Beam Lithography on Organic Ice Resists|Electron-Beam Lithography on Organic Ice Resists]] | |||
*'''Overview:''' [[/SEM-LEO Customizations for Organic Ice Resists|SEM-LEO Customizations for Organic Ice Resists]] | |||
==Project Description== | ==Project Description== | ||
| Line 24: | Line 26: | ||
*; Organic Ice Resists | *; Organic Ice Resists | ||
*: [[File:Graphical Abstract.gif|300px]] | |||
*: [https://doi.org/10.1021/acs.nanolett.7b04190 Link to Article] | |||
*: <u>W. Tiddi</u>, A. Elsukova, H. T. Le, P. Liu, M. Beleggia, and A. Han<br> ''Nano Letters'', vol. 17, pp. 7886-7891, 2017. | *: <u>W. Tiddi</u>, A. Elsukova, H. T. Le, P. Liu, M. Beleggia, and A. Han<br> ''Nano Letters'', vol. 17, pp. 7886-7891, 2017. | ||
** '''Overview:''' [[/Electron-Beam Lithography on Organic Ice Resists|Electron-Beam Lithography on Organic Ice Resists]] | |||
*; Organic ice resists for 3D electron-beam processing - Instrumentation and operation | |||
*; Organic ice resists for 3D electron-beam processing - Instrumentation and operation | |||
*: [[File:Graphical Abstract.jpg|300px]] | |||
*: [https://doi.org/10.1016/j.mee.2018.01.021 Link to Article] | |||
*: <u>W. Tiddi</u>, A. Elsukova, M. Beleggia, and A. Han<br> ''Microelectronic Engineering'', vol. 192, pp. 38-43, 2018. | *: <u>W. Tiddi</u>, A. Elsukova, M. Beleggia, and A. Han<br> ''Microelectronic Engineering'', vol. 192, pp. 38-43, 2018. | ||
** '''Overview:''' [[/SEM-LEO Customizations for Organic Ice Resists|SEM-LEO Customizations for Organic Ice Resists]] | |||
*; Inductively coupled plasma nanoetching of atomic layer deposition alumina | *; Inductively coupled plasma nanoetching of atomic layer deposition alumina | ||
*: [[File:Graphical Abstract2.jpg|300px]] | |||
*: [https://doi.org/10.1016/j.mee.2018.02.023 Link to Article] | |||
*: A. Han, B. Chang, M. Todeschini, H. T. Le, <u>W. Tiddi</u> and M. Keil<br> ''Microelectronic Engineering'', vol. 193, pp. 28-33, 2018. | *: A. Han, B. Chang, M. Todeschini, H. T. Le, <u>W. Tiddi</u> and M. Keil<br> ''Microelectronic Engineering'', vol. 193, pp. 28-33, 2018. | ||
===Published Patents=== | ===Published Patents=== | ||
*; A METHOD FOR CREATING STRUCTURES OR DEVICES USING AN ORGANIC ICE RESIST. | *; A METHOD FOR CREATING STRUCTURES OR DEVICES USING AN ORGANIC ICE RESIST. | ||
*:[http://patentscope.wipo.int/search/en/WO2017191079 Link to Patent Database] | |||
*: A. Han (Inventor), <u>W. Tiddi</u> (Inventor), M. Beleggia (Inventor)<br> IPC No.: B29C 67/ 00 A I. Patent No.: WO2017191079. Nov 09, 2017. | *: A. Han (Inventor), <u>W. Tiddi</u> (Inventor), M. Beleggia (Inventor)<br> IPC No.: B29C 67/ 00 A I. Patent No.: WO2017191079. Nov 09, 2017. | ||
| Line 57: | Line 70: | ||
Physical dimension of integrated circuits keep shrinking at exponential rates, due market demand for faster, more powerful, longer-lasting and more compact electronic devices. Standard fabrication techniques manage to keep up the pace, but need to resort to extremely expensive equipment, increased fabrication complexity and intense research for dedicated chemicals satisfying the tightening process constraints. | Physical dimension of integrated circuits keep shrinking at exponential rates, due market demand for faster, more powerful, longer-lasting and more compact electronic devices. Standard fabrication techniques manage to keep up the pace, but need to resort to extremely expensive equipment, increased fabrication complexity and intense research for dedicated chemicals satisfying the tightening process constraints. | ||
Ice lithography is a nanopatterning technique derived from electron beam lithography, showing feature resolution below 10nm. A thin ice layer condensed on the sample takes the role of the lithographic resist film when exposed to electron or ion beams. This process is immensely cheaper and more sustainable than state-of-the-art techniques relying on physical masks and aggressive chemistries. | Ice lithography is a nanopatterning technique derived from electron beam lithography, showing feature resolution below 10nm. A thin water ice layer condensed on the sample takes the role of the lithographic resist film when exposed to electron or ion beams. This process is immensely cheaper and more sustainable than state-of-the-art techniques relying on physical masks and aggressive chemistries. | ||
We investigate ice lithography and the steps it needs to be ported from research to future industry, establishing its potential as the break-through technology needed to advance further in the ultra large scale integration semiconductor roadmap. | |||
Want to know more? | Want to know more? | ||