LabAdviser/Technology Research/Organic Ice Resists for Electron-Beam Lithography - Instrumentation and Processes: Difference between revisions
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'''Feedback to this page''': '''[mailto:labadviser@ | '''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/LabAdviser/Technology_Research/Ice_Lithography_for_Advanced_Nanofabrication click here]''' | ||
=Organic Ice Resists for Electron-Beam Lithography - Instrumentation and Processes= | =Organic Ice Resists for Electron-Beam Lithography - Instrumentation and Processes= | ||
*'''Project type:''' Ph.D. project | *'''Project type:''' Ph.D. project | ||
*'''Project responsible:''' William Tiddi | *'''Project responsible:''' William Tiddi ([http://orbit.dtu.dk/en/persons/william-tiddi(7603153a-3652-4965-8e92-62b3a5deb499).html DTU Orbit]) | ||
*'''Supervisors:''' Assoc. Prof. Marco Beleggia, Assist. Prof. Anpan Han | *'''Supervisors:''' Assoc. Prof. Marco Beleggia, Assist. Prof. Anpan Han | ||
*'''Partners involved:''' DTU Danchip/Cen | *'''Partners involved:''' DTU Nanolab (former DTU Danchip/DTU Cen) | ||
*'''Full thesis:''' [[:File:PhDthesisPapers_v2.pdf|Link]] | |||
*'''Overview:''' [[/Electron-Beam Lithography on Organic Ice Resists|Electron-Beam Lithography on Organic Ice Resists]] | |||
*'''Overview:''' [[/SEM-LEO Customizations for Organic Ice Resists|SEM-LEO Customizations for Organic Ice Resists]] | |||
==Project Description== | ==Project Description== | ||
[[image: | [[image:ProcessOIR.png|500px|thumb|Lithography process for Organic Ice Resists]] | ||
Fabrication of micro- and nanostructures, the building blocks of modern electronics and nanotechnology, requires one or more lithography iterations where the desired geometries are defined in a sacrificial layer, the resist, to be transferred into a functional material. A typical lithography process involves | Fabrication of micro- and nanostructures, the building blocks of modern electronics and nanotechnology, requires one or more lithography iterations where the desired geometries are defined in a sacrificial layer, the resist, to be transferred into a functional material. A typical lithography process involves | ||
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We explored, characterized and optimized this novel technology in detail to make it accessible to the broader nanotechnology community. The entire lithography requires no other tool and uses trivial amounts of readily available precursor material; at the same time performances in terms of dose and resolution are comparable to established resists, and the resulting features are directly compatible with established processes developed for resist-based pattern transfer. | We explored, characterized and optimized this novel technology in detail to make it accessible to the broader nanotechnology community. The entire lithography requires no other tool and uses trivial amounts of readily available precursor material; at the same time performances in terms of dose and resolution are comparable to established resists, and the resulting features are directly compatible with established processes developed for resist-based pattern transfer. | ||
==Dissemination== | |||
===Publications in Peer Reviewed Journals=== | |||
*; Organic Ice Resists | |||
*: [[File:Graphical Abstract.gif|300px]] | |||
*: [https://doi.org/10.1021/acs.nanolett.7b04190 Link to Article] | |||
*: <u>W. Tiddi</u>, A. Elsukova, H. T. Le, P. Liu, M. Beleggia, and A. Han<br> ''Nano Letters'', vol. 17, pp. 7886-7891, 2017. | |||
** '''Overview:''' [[/Electron-Beam Lithography on Organic Ice Resists|Electron-Beam Lithography on Organic Ice Resists]] | |||
*; Organic ice resists for 3D electron-beam processing - Instrumentation and operation | |||
*: [[File:Graphical Abstract.jpg|300px]] | |||
*: [https://doi.org/10.1016/j.mee.2018.01.021 Link to Article] | |||
*: <u>W. Tiddi</u>, A. Elsukova, M. Beleggia, and A. Han<br> ''Microelectronic Engineering'', vol. 192, pp. 38-43, 2018. | |||
** '''Overview:''' [[/SEM-LEO Customizations for Organic Ice Resists|SEM-LEO Customizations for Organic Ice Resists]] | |||
*; Inductively coupled plasma nanoetching of atomic layer deposition alumina | |||
*: [[File:Graphical Abstract2.jpg|300px]] | |||
*: [https://doi.org/10.1016/j.mee.2018.02.023 Link to Article] | |||
*: A. Han, B. Chang, M. Todeschini, H. T. Le, <u>W. Tiddi</u> and M. Keil<br> ''Microelectronic Engineering'', vol. 193, pp. 28-33, 2018. | |||
===Published Patents=== | |||
*; A METHOD FOR CREATING STRUCTURES OR DEVICES USING AN ORGANIC ICE RESIST. | |||
*:[http://patentscope.wipo.int/search/en/WO2017191079 Link to Patent Database] | |||
*: A. Han (Inventor), <u>W. Tiddi</u> (Inventor), M. Beleggia (Inventor)<br> IPC No.: B29C 67/ 00 A I. Patent No.: WO2017191079. Nov 09, 2017. | |||
===Conferences and Workshops Contributions=== | |||
*; Organic ice resists - condensed small molecules as spin-free volatile E-beam resists | |||
*: <u>W. Tiddi</u>, A. Elsukova, H. T. Le, M. Beleggia, and A. Han<br> Oral presentation at ''43rd International conference on Micro and Nano Engineering'', Braga, Portugal, 2017. | |||
*; Ice lithography - ice-based nanopatterning | |||
*: <u>W. Tiddi</u><br> Workshop lecture at ''Nordic Nanolab User Meeting 2017'', Trondheim, Norway, 2017. | |||
*; Advances in Ice Lithography in Denmark and China | |||
*: <u>W. Tiddi</u>, D. Zhao, M. Qiu, M. Beleggia, and A. Han<br> Abstract and Poster at ''42nd International conference on Micro and Nano Engineering'', Vienna, Austria, 2016. | |||
*; Ice lithography - water-based nanopatterning. | |||
*: <u>W. Tiddi</u>, M. Beleggia, and A. Han<br> Abstract and Poster at ''Sustain-ATV Conference 2016'', Kgs. Lyngby, Denmark, 2016. | |||
*; Proximity Effects in a Chemically Amplified Electron Beam Resist Patterned at 100 keV. | |||
*: <u>W. Tiddi</u>, T. Greibe, M. Beleggia, and A. Han<br> Abstract and Poster at ''41st International conference on Micro and Nano Engineering'', The Hague, Netherlands, 2015. | |||
==Ice Lithography== | ==Ice Lithography== | ||
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Physical dimension of integrated circuits keep shrinking at exponential rates, due market demand for faster, more powerful, longer-lasting and more compact electronic devices. Standard fabrication techniques manage to keep up the pace, but need to resort to extremely expensive equipment, increased fabrication complexity and intense research for dedicated chemicals satisfying the tightening process constraints. | Physical dimension of integrated circuits keep shrinking at exponential rates, due market demand for faster, more powerful, longer-lasting and more compact electronic devices. Standard fabrication techniques manage to keep up the pace, but need to resort to extremely expensive equipment, increased fabrication complexity and intense research for dedicated chemicals satisfying the tightening process constraints. | ||
Ice lithography is a nanopatterning technique derived from electron beam lithography, showing feature resolution below 10nm. A thin ice layer condensed on the sample takes the role of the lithographic resist film when exposed to electron or ion beams. This process is immensely cheaper and more sustainable than state-of-the-art techniques relying on physical masks and aggressive chemistries. | Ice lithography is a nanopatterning technique derived from electron beam lithography, showing feature resolution below 10nm. A thin water ice layer condensed on the sample takes the role of the lithographic resist film when exposed to electron or ion beams. This process is immensely cheaper and more sustainable than state-of-the-art techniques relying on physical masks and aggressive chemistries. | ||
We investigate ice lithography and the steps it needs to be ported from research to future industry, establishing its potential as the break-through technology needed to advance further in the ultra large scale integration semiconductor roadmap. | |||
Want to know more? | Want to know more? | ||