Specific Process Knowledge/Lithography/Descum: Difference between revisions
| Line 233: | Line 233: | ||
==Comparison of ashing rate between substrate sizes== | ==Comparison of ashing rate between substrate sizes== | ||
[[Specific_Process_Knowledge/Lithography/Strip#Comparison_of_ashing_rate_between_substrate_sizes_for_plasma_asher_4_&_5| | It is assumed that the low power descum rates for different substrate sizes follows the same pattern, as the high power ashing rates, which cab be seen [[Specific_Process_Knowledge/Lithography/Strip#Comparison_of_ashing_rate_between_substrate_sizes_for_plasma_asher_4_&_5|here]]. | ||
=Plasma Asher 5= | =Plasma Asher 5= | ||