Specific Process Knowledge/Characterization/MicroSpectroPhotometer (Craic 20/30 PV): Difference between revisions
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image:eves_CRAIC_transmittance_fused_silica_wafer_20231002.png|Transmittance measurement of a fused silica wafer. Standard CRAIC quartz sample was used as a reference. Objective 10X, Aperture number: 2. | image:eves_CRAIC_transmittance_fused_silica_wafer_20231002.png|Transmittance measurement of a fused silica wafer. Standard CRAIC quartz sample was used as a reference. Objective 10X, Aperture number: 2. | ||
image:eves_CRAIC_transmittance_alu_tio_multi_5x5_10bilayers_20231002.png|Transmittance measurement of a fused silica wafer. Standard CRAIC quartz sample was used as a reference. Objective 10X, Aperture number: 2. | image:eves_CRAIC_transmittance_alu_tio_multi_5x5_10bilayers_20231002.png|Transmittance measurement of an alumina-titania stack of total thickness of 100nm deposited on a fused silica wafer using ALD. Each layer is 5nm, so 10 bilayers in total. Standard CRAIC quartz sample was used as a reference. Objective 10X, Aperture number: 2. | ||
image:eves_CRAIC_transmittance_rmal_Au_on_APTMS_20231002.png|Transmittance measurement of a fused silica wafer. Standard CRAIC quartz sample was used as a reference. Objective 10X, Aperture number: 2. | image:eves_CRAIC_transmittance_rmal_Au_on_APTMS_20231002.png|Transmittance measurement of a fused silica wafer. Standard CRAIC quartz sample was used as a reference. Objective 10X, Aperture number: 2. | ||
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