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Specific Process Knowledge/Lithography/5214E: Difference between revisions

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DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, danchip
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Jehem (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, danchip
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'''Typical image reversal parameters:'''
'''Typical image reversal parameters:'''
*Reversal bake temperature: 110°C
*Reversal bake temperature: 110°C
*Reversal bake time: 60-120 s
*Reversal bake time: 60 s
*Flood exposure: 200-500 mJ/cm<sup>2</sup>
*Flood exposure: 500 mJ/cm<sup>2</sup>




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