Specific Process Knowledge/Lithography/Resist/DUVresist: Difference between revisions
| Line 2: | Line 2: | ||
The spinning process will be performed by the customer together with the Photolith group of Nanolab. In case you would like to do DUV lithography please contact Lithography team, who will consult you and run your wafers together with you. | The spinning process will be performed by the customer together with the Photolith group of Nanolab. In case you would like to do DUV lithography please contact Lithography team, who will consult you and run your wafers together with you. | ||
'''Bottom Anti Reflection Coating (BARC):''' | |||
*Manufacturers website: [http://www.brewerscience.com/products/arc/dry-etch-arc-coatings/248nm-products/duv42s DUV 42S-6] | |||
*Datasheet: [https://labmanager.dtu.dk/view_binary.php?class=MiscDocument&id=4&name=Datasheet+DUV42S.pdf DUV42S-6] - '''requires login''' | |||
'''Positive DUV resist for spin coating in 600-300nm thickness range:''' | |||
*[[Media:M230Y_PSM_annular_130C_PEB.pdf|KRF M230Y]] | |||
'''Positive DUV resist for spin coating in 1600-800nm thickness range:''' | |||
*[[Media:M35G_Danchip_intro.pdf|KRF M35G]] | |||
'''Negative DUV resist for spin coating in 1400-800nm or diluted with EC Solvent in 1:1 in 400-200nm thickness range:''' | |||
*[[Media:UVN2300.pdf|UVN2300-0.8]]. | |||