Specific Process Knowledge/Lithography/5214E: Difference between revisions

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	If 5214E is baked after exposure, the exposed resist will cross-link, making it insoluble in the developer. This is called the "Reversal bake"~~, or sometimes the post-exposure bake~~. The reversal bake activates cross-linking of the exposed areas, which "reverses" the polarity of the design.		If 5214E is baked after exposure, the exposed resist will cross-link, making it insoluble in the developer. This is called the "Reversal bake". The reversal bake activates cross-linking of the exposed areas, which "reverses" the polarity of the design.

	If the substrate is flood exposed after the reversal bake, the previously unexposed areas become soluble, and will be removed in the subsequent development. The reversal procedure effectively makes AZ 5214E a negative resist.		If the substrate is flood exposed after the reversal bake, the previously unexposed areas become soluble, and will be removed in the subsequent development. The reversal procedure effectively makes AZ 5214E a negative resist.