Specific Process Knowledge/Lithography/5214E: Difference between revisions
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==Image reversal== | ==Image reversal== | ||
'''Typical image reversal parameters:''' | |||
*Reversal bake temperature: 110°C | |||
*Reversal bake time: 60-120 s | |||
*Flood exposure: 200-500 mJ/cm<sup>2</sup> | |||
If 5214E is baked after exposure, the exposed resist will cross-link, making it insoluble in the developer. This is called the "Reversal bake", or sometimes the post-exposure bake. The reversal bake activates cross-linking of the exposed areas, which "reverses" the polarity of the design. | If 5214E is baked after exposure, the exposed resist will cross-link, making it insoluble in the developer. This is called the "Reversal bake", or sometimes the post-exposure bake. The reversal bake activates cross-linking of the exposed areas, which "reverses" the polarity of the design. | ||