Jump to content

Specific Process Knowledge/Thermal Process/Furnace APOX: Difference between revisions

Jmli (talk | contribs)
No edit summary
Jmli (talk | contribs)
Line 13: Line 13:
The APOX furnace (D1) is a Tempress horizontal furnace for oxidation silicon wafers. This furnace is dedicated for oxidation of new and clean Si wafers to form apox layers which is a very thick wet thermal oxide grown at 1075<sup>o</sup>C. Running a batch of apox wafers (oxide thickness > 5µm) can take several weeks, depending on how thick an apox layer that is required.   
The APOX furnace (D1) is a Tempress horizontal furnace for oxidation silicon wafers. This furnace is dedicated for oxidation of new and clean Si wafers to form apox layers which is a very thick wet thermal oxide grown at 1075<sup>o</sup>C. Running a batch of apox wafers (oxide thickness > 5µm) can take several weeks, depending on how thick an apox layer that is required.   


This furnace is positioned in the III-V cleanroom area. Only Danchip employees are allowed to operate the furnace.  
This furnace is positioned in the III-V cleanroom area. Only Nanolab employees are allowed to operate the furnace.  


'''The user manual, technical information and contact information can be found in LabManager:'''
'''The user manual, technical information and contact information can be found in LabManager:'''