View source for Specific Process Knowledge/Thermal Process/Storage and cleaning of wafer to the A, B, C and E stack furnaces

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==RCA cleaning of wafers for the A, B, C and E stack furnaces==


====A1 furnace:====
*All wafers have to be RCA cleaned, this includes both new and processed wafers. The wafers should be cleaned the same day as they are going into the furnace. Remember to RCA clean a test wafer and dummy wafers (if needed).
*Before boron pre-deposition, the silicon carbide boat and the boron source wafers have to be RCA cleaned.

====A2 and A4 furnaces:====
*All wafers have to be RCA cleaned, this includes both new and processed wafers. The wafers should be cleaned the same day as they are going into the furnace. Remember to RCA clean a test wafer and dummy wafers (if needed).

====A3 furnaces:====
*All wafers have to be RCA cleaned, this includes both new and processed wafers, except wafers from the A4 furnace. The wafers should be cleaned the same day as they are going into the furnace. Remember to RCA clean a test wafer and dummy wafers (if needed).

====B2, B3, B4, E2 and E3 furnaces (LPCVD furnaces):====
*New silicon wafers can go directly into the furnaces. 
*Wafers from the A stack furnaces and the C1 furnace can go directly into the furnace. 
*Other processed wafers and new quartz wafers have to be RCA cleaned. The wafers can be cleaned the day before they are going into the furnace. 

====C1 furnace:====
*New silicon wafers can go directly into the furnace. 
*Wafers from the A, B and E stack furnaces and from PECVD4 can go directly into the furnace. 
*Other processed wafers and new quartz wafers have to be RCA cleaned. The wafers can be cleaned the day before they are going into the furnace. 

====C2 furnace:====
*Dedicated for oxidation of III-V materials. More information can be found [[Specific_Process_Knowledge/Thermal_Process/C2_Furnace_III-V_oxidation | here]].

====C3 furnace:====
*New silicon wafers can go directly into the furnace. 
*Wafers from the A, B and E stack furnaces, from the C1 furnace and from PECVD3, PECVD4 and Wafer Bonder 02 can go directly into the furnace. 
*Other processed wafers and new quartz wafers have to be RCA cleaned. The wafers can be cleaned the day before they are going into the furnace. 
*Wafer pieces are allowed in the furnace, if these have been RCA cleaned.

====C4 furnace:====
*For annealing of wafers and wafer pieces with Al, Al2O3 and TiO2. The samples cannot be RCA cleaned. 

====E1 furnace:====
*New silicon wafers can go directly into the furnace. 
*Other processed wafers and new quartz wafers have to be RCA cleaned. The wafers can be cleaned the day before they are going into the furnace. 


==Storage and transportation of wafers for the A, B, C and E stack furnaces==

====RCA cleaned wafers:====
*The wafers have to be stored in dedicated blue or black "RCA transfer" boxes, until they go into a furnace

====New wafers:====
*The wafers have to be stored in clean wafer boxes, i.e. boxes have only contained new wafers (do NOT use wafer boxes from the dressing area), or they can be stored in dedicated blue or black "Furnace transfer" boxes.

====Wafers from one furnace to another furnace:====
*The wafers have to be stored in dedicated blue or black "Furnace transfer" boxes.