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Comparing lithography methods at DTU Danchip
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UV Lithography
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DUV Stepper Lithography
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E-beam Lithography
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Nano Imprint Lithography
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| Generel description
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Pattern transfer via UltraViolet (UV) light
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Pattern transfer via DeepUltraViolet (DUV) light
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Patterning by electron beam
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Pattern transfer via hot embossing (HE)
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| Pattern size range
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- Resist type, thickness, and pattern dependent
- ~1.25 µm and up
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- pattern type, shape and pitch dependent
- ~200 nm and up
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| Resist type
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- UV sensitive:
- AZ 5214E, AZ 4562, AZ MiR 701 (positive)
- AZ 5214E, AZ nLOF 2020, SU-8 (negative)
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- DUV sensitive
- JSR KRF M230Y, JSR KRF M35G (positive)
- UVN2300-0.8 (negative)
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- E-beam sensitive
- AR-P6200 CSAR, ZEP502A , PMMA, HSQ, mr-EBL, AR-N 7520
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| Resist thickness range
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~0.5µm to 20µm
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~50nm to 2µm
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~30nm to 0.5 µm
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~ 100nm to 2µm
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| Typical exposure time
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2s-30s pr. wafer
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Process depended, depends on pattern, pattern area and dose
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Depends on dose, Q [µC/cm2], beam current, I [A], and pattern area, A [cm2]: t = Q*A/I
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Process depended, depends also on heating and cooling temperature rates
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| Substrate size
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- small samples
- 50 mm wafers
- 100 mm wafers
- 150 mm wafers
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- 100 mm wafers
- 150 mm wafers
- 200 mm wafers
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We have cassettes that fit to
- 4 small samples (20mm, 12mm, 8mm, 4mm)
- 6 wafers of 50 mm in size
- 3 wafers of 100 mm in size
- 1 wafer of 150 mm in size
Only one cassette can be loaded at time
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- small samples
- 50 mm wafers
- 100 mm wafers
- 150 mm wafers
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| Allowed materials
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- Any standard cleanroom material
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- Any standard cleanroom material
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- Any standard cleanroom material
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- Any standard cleanroom material
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Equipment Pages
Lithography Tool Package Training
DTU Danchip offers a Tool Package Training in Lithography; the course includes theory on lithographic processes and equipment, as well as training in equipment operation and processing in the cleanroom.
The course is for all users that intend to perform any kind of lithographic processing in the cleanroom, and is a prerequisite for training in other lithography equipment.
| Lithography Tool Package Training
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| Schedule
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Theoretical part
- The lecture has been replaced by videos that can be viewed at one's own leisure.
- A 1 hour "questions and exercises" session once or twice a month will be planned as needed.
- NEXT "questions and exercises" sessions: Monday 6th of February 13:00-14:00, Friday 10th of February 10:00-11:00
Practical part
- A 4-5 hour training session once a week, max. 4 persons per session (9:00 - 14:00).
- NEXT training sessions: 8th of February, 15th of February, 22nd of February
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| Location
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Theoretical part
- The location of the "questions and exercises" session will be specified after signing up for the course.
Practical part
- The training session takes place inside the cleanroom. The meeting point will be in front of the first machine.
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| Qualified Prerequisites
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- Cleanroom safety course at DTU Danchip
- Admission to the cleanroom must be obtained before the training session
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| Preparations
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Before the "questions and exercises" session
- Read Sami Franssila "Introduction to Microfabrication" (2010), Chapter 9: Optical Lithography. (Available online from DTU campus)
- Watch the lecture videos (7 videos, 2:41 hours in total). Write down any questions that may arise during the videos.
Before training session
- Watch the training videos of spin coating (automatic), exposure (operation, and alignment), and development (automatic).
- Study the equipment manuals. The manuals are available in LabManager.
- Study the TPT process flows (first print, and alignment).
Links to literature, lecture videos, training videos, equipment manuals, and process flows can be found in the "Knowledge and Information" section below.
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| Course Responsible
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The Lithography Group at DTU Danchip.
Sign up for the course by e-mailing to lithography@danchip.dtu.dk.
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| Learning Objectives
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- Describe fundamental parts of lithographic processing in a cleanroom, design of process flows
- Authorization to use spin coater, mask aligner, and developer at DTU Danchip
- Calculate relevant process parameters
- Analyze and apply your results of lithographic processing
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Knowledge and Information about Lithography
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Literature
Lecture videos
Slides from Lecture
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Training videos
Manuals
Process Flows
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Resists
UV Exposure
Electron Beam Exposure
Deep-UV Exposure
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