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Comparing lithography methods at DTU Danchip
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UV Lithography
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DUV Stepper Lithography
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E-beam Lithography
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Nano Imprint Lithography
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| Generel description
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Pattern transfer via UltraViolet (UV) light
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Pattern transfer via DeepUltraViolet (DUV) light
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Patterning by electron beam
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Pattern transfer via hot embossing (HE)
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| Pattern size range
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- Resist type, thickness, and pattern dependent
- ~1.25 µm and up
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- pattern type, shape and pitch dependent
- ~200 nm and up
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| Resist type
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- UV sensitive:
- AZ 5214E, AZ 4562, AZ MiR 701 (positive)
- AZ 5214E, AZ nLOF 2020, SU-8 (negative)
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- DUV sensitive
- JSR KRF M230Y, JSR KRF M35G (positive)
- UVN2300-0.8 (negative)
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- E-beam sensitive
- AR-P6200 CSAR, ZEP502A , PMMA, HSQ, mr-EBL, AR-N 7520
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| Resist thickness range
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~0.5µm to 20µm
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~50nm to 2µm
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~30nm to 0.5 µm
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~ 100nm to 2µm
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| Typical exposure time
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2s-30s pr. wafer
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Process depended, depends on pattern, pattern area and dose
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Depends on dose, Q [µC/cm2], beam current, I [A], and pattern area, A [cm2]: t = Q*A/I
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Process depended, depends also on heating and cooling temperature rates
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| Substrate size
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- small samples
- 50 mm wafers
- 100 mm wafers
- 150 mm wafers
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- 100 mm wafers
- 150 mm wafers
- 200 mm wafers
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We have cassettes that fit to
- 4 small samples (20mm, 12mm, 8mm, 4mm)
- 6 wafers of 50 mm in size
- 3 wafers of 100 mm in size
- 1 wafer of 150 mm in size
Only one cassette can be loaded at time
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- small samples
- 50 mm wafers
- 100 mm wafers
- 150 mm wafers
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| Allowed materials
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- Any standard cleanroom material
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- Any standard cleanroom material
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- Any standard cleanroom material
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- Any standard cleanroom material
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Equipment Pages
Lithography Tool Package Training
DTU Danchip offers a Tool Package Training in Lithography; the course includes theory on lithographic processes and equipments, as well as training in equipment operation and processing in the cleanroom.
The course is for all users that intend to perform any kind of lithographic processing in the cleanroom.
| Lithography Tool Package Training
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| Schedule
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- Lecture once a month (~3.5 hours). NEXT LECTURE: Starting February 2017 (Week 06), the lecture will be replaced by videos and a short "questions and exercises" session. More info will come later this month.
- Training session once a week, max. 4 persons per session (9:00 - 14:00). NEXT SESSIONS: 8th of February, 15th of February, 22nd of February
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| Location
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Seminar room bulding 347 at DTU Danchip and in cleanroom facilities at DTU Danchip
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| Qualified Prerequisites
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- Cleanroom safety course at DTU Danchip
- Wet Chemistry Course at DTU Danchip (Lab-Intro)
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| Preparations
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Before the lecture
- Read Sami Franssila "Introduction to Microfabrication" (2010), Chapter 9: Optical Lithography. (Available online from DTU campus, see link below)
- Optional but recommended: Watch the training videos (training videos can be found below).
Before training session
- Watch the training videos of spin coating (automatic), exposure (operation and alignment), and development (automatic). The training videos can be found below.
- Study the equipment manuals. The manuals are available in LabManager.
- Study the TPT process flows (first print and alignment). The process flows can be found below.
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| Course Responsible
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The Lithography Group at DTU Danchip: sign up for the course by e-mailing to lithography@danchip.dtu.dk.
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| Learning Objectives
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- Describe fundamental parts of lithographic processing in a cleanroom, design of process flows
- Authorization to use spin coater, mask aligner, and developer at DTU Danchip
- Calculate relevant process parameters
- Analyze and apply your results of lithographic processing
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Knowledge and Information about Lithography
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Literature
July TPT lecture
Training videos
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Manuals
Process Flows
Slides from Lecture
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Resists
UV Exposure
Electron Beam Exposure
Deep-UV Exposure
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