Specific Process Knowledge/Etch
Feedback to this page: click here
Wet etch or dry etch
Etching at Danchip can be done either with wet chemistry or in dry etch equipment. In general wet chemistry etches isotropically in most materials were as dry etch techniques can be optimized to transfer a given mask pattern with vertical sidewalls (anisotropically) to a given substrate.
Advantages of wet chemistry over dry etch techniques are:
- An often high etch rate difference of different materials giving raise to a high selectivity of the material to be etched compared to underlaying layers or mask materials.
- Time saving: You can often etch 25 wafers at a time in wet chemistry where as dry etch equipment can only handle one wafer at a time.
- Easy to start up new etch solutions.
Advantages of dry etch over wet chemistry:
- Anisotropic etch can be done.
- The etch does not attack the backside of the sample.
Choose material to be etched
Dielectrica | Semicondutors | Metals | Alloys | Polymers |
|
|
Choose Method/Equipment for the Etch
A Dry Etch Equipment | A Wet Etch |
|
TPT Dry Etch
- First course is the 23rd of February - please sign up now by writing to Jonas and Berit [1]
- Here you will soon find links to tool packages training videos and the lecture slides with explanatory text included.
- Before the lecture please watch the following video: "Introduction to Dry Etch Equipment". You can find it on the cleanroom drive: U:\DCH\CleanroomDrive\_TPT
- Lecture slide show Media:TPT Dry etching 20170223.pptx
- Lecture slides with explanatory text included Media:TPT Dry etching with notes 20170223.pdf
- For more information take a look at the Danchip homepage: Dry Etch TPT