Specific Process Knowledge/Lithography: Difference between revisions
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*[[Specific Process Knowledge/Lithography/Coaters#Spin Track 1 + 2|Spin Track 1 + 2]] | *[[Specific Process Knowledge/Lithography/Coaters#Spin Track 1 + 2|Spin Track 1 + 2]] | ||
*[[Specific Process Knowledge/Lithography/Coaters#Spin_Coater:_RCD8|Spin Coater: RCD8]] | *[[Specific Process Knowledge/Lithography/Coaters#Spin_Coater:_RCD8|Spin Coater: RCD8]] | ||
*[[Specific_Process_Knowledge/Lithography/Coaters#Manual_Spin_Coaters|Manual | *[[Specific_Process_Knowledge/Lithography/Coaters#Manual_Spin_Coaters|Spin Coater: Manual ...]] | ||
*[[Specific_Process_Knowledge/Lithography/Coaters/SprayCoater|Spray Coater]] | *[[Specific_Process_Knowledge/Lithography/Coaters/SprayCoater|Spray Coater]] | ||
*[[Specific Process Knowledge/Lithography/DUVStepper#SÜSS Spinner-Stepper|Spin coater: Süss Stepper]] | *[[Specific Process Knowledge/Lithography/DUVStepper#SÜSS Spinner-Stepper|Spin coater: Süss Stepper]] |
Revision as of 16:49, 18 May 2016
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Comparing lithography methods at DTU Danchip
UV Lithography | DUV Stepper Lithography | E-beam Lithography | Nano Imprint Lithography | 2-Photon Polymerization Lithography | |
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Generel description | Pattern transfer via UltraViolet (UV) light | Pattern transfer via DeepUltraViolet (DUV) light | Patterning by electron beam | Pattern transfer via hot embossing(HE) | Direct writing via IR laser |
Pattern size range |
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Resist type |
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Resist thickness range |
~0.5µm to 20µm |
~50nm to 2µm |
~30nm to 0.5 µm |
~ 100nm to 2µm |
droplet or coating |
Typical exposure time |
2s-30s pr. wafer |
Process depended, depends on pattern, pattern area and dose |
Depends on dose, Q [µC/cm2], beam current, I [A], and pattern area, A [cm2]: t = Q*A/I |
Process depended, depends also on heating and cooling temperature rates |
Process depended, depends on pattern and dose |
Substrate size |
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We have cassettes that fit to
Only one cassette can be loaded at time |
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Allowed materials |
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Equipment Pages
3D Lithography |
Lithography Tool Package Training
DTU Danchip offers a Tool Package Training in Lithography; the course includes theory on lithographic processes and equipments, as well as training in equipment operation and processing in the cleanroom.
The course is for all users that intend to perform any kind of lithographic processing in the cleanroom.
Tool Package Training Lithography | |
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Schedule |
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Location | Meeting room bulding 347 at DTU Danchip and in cleanroom facilities at DTU Danchip |
Qualified Prerequisites |
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Preparations |
Before the lecture
Before training session
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Course Responsible |
The Lithography Group at DTU Danchip: sign up for the course by e-mailing to lithography@danchip.dtu.dk. |
Learning Objectives |
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Knowledge and Information about Lithography
Literature
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Manuals
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Resists
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