Sputtering of Ti in Wordentec

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Deposition rate

The deposition rate will change with the settings for pressure and power.

Pressure: 1*10^-2 mbar, Power: 300 W

The rate in the Wordentec is established to be 1.7 Å/s (in the centre of the wafer, 1.3 Å/s at the edge) (data from before 2018).