Specific Process Knowledge/Back-end processing/Hot Embosser

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Hot Embosser

The Hot Embosser at DTU Nanolab is a hydraulic machine, a Collin Press P300 SV. It is located in the basement of building 346 (room 901).


File:Cluster1.jpg
Image(s) of the equipment(s)


The user manual(s), quality control procedure(s) and results, user APV(s), technical information and contact information can be found in LabManager:

Hot Embosser in LabManager

Process information

At the moment there are no set processes for the machine. Each material demands different process parameters, depending on the type of process you are running. For development of process that fits your needs contact for the machine responsible personel, and we will assist you in designing the optimal process

Equipment performance and process related parameters

Equipment Equipment 1
Purpose
  • Hot Embossing
  • Chip Bonding
Performance Press Plates Temperature
  • Upper Plate max temperature 285 degrees Celsius
  • Lower Plate max temperature 285 degrees Celsius
Press Plates Pressure
  • Max pressure allowed 300 kN
Process parameter range Temperature
  • 0-285 degrees Celsius
Pressure
  • 1.5-300 kN
Substrates Batch size
  • # small samples
  • # 50 mm wafers
  • # 100 mm wafers
  • # 150 mm wafers
  • # 200 mm wafers
  • # odd sized samples, contact for the machine responsible personel
Allowed materials
  • PMMA
  • TOPAS 5013-L10
  • TOPAS 8007
  • PC
  • PP
  • PCL
  • SU8
  • Graphene
  • Metals (Al,Ni....)
  • For other materials contact for machine responsible personel