Specific Process Knowledge/Back-end processing/Hot Embosser: Difference between revisions

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Example:
Example:
*[[Specific Process Knowledge/Etch/Etching of Silicon/Si etch using RIE1 or RIE2|Etch of silicon using RIE]]
*
*[[Specific Process Knowledge/Etch/Etching of Silicon Oxide/SiO2 etch using RIE1 or RIE2|Etch of silicon oxide using RIE]]
*[[Specific Process Knowledge/Etch/Etching of Silicon Nitride/Etch of Silicon Nitride using RIE|Etch of silicon nitride using RIE]]
*[[Specific Process Knowledge/Etch/Etching of Polymer/Etch of Photo Resist using RIE|Etch of photo resist using RIE]]


==Equipment performance and process related parameters==
==Equipment performance and process related parameters==

Revision as of 15:52, 25 February 2020

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Name of equipment

Write a short description of the equipment(s).

File:Cluster1.jpg
Image(s) of the equipment(s)


The user manual(s), quality control procedure(s) and results, user APV(s), technical information and contact information can be found in LabManager:

RIE1 in LabManager

Process information

Link to process pages - e.g. one page for each material

Example:

Equipment performance and process related parameters

Equipment Equipment 1 Equipment 2
Purpose
  • Purpose 1
  • Purpose 2
  • Purpose 1
  • Purpose 2
  • Purpose 3
Performance Response 1
  • Performance range 1
  • Performance range 2
  • Performance range 1
  • Performance range 2
  • Performance range 3
Response 2
  • Performance range
  • Performance range
Process parameter range Parameter 1
  • Range
  • Range
Parameter 2
  • Range
  • Range
Substrates Batch size
  • # small samples
  • # 50 mm wafers
  • # 100 mm wafers
  • # 150 mm wafers
  • # small samples
  • # 50 mm wafers
  • # 100 mm wafers
  • # 150 mm wafers
Allowed materials
  • Allowed material 1
  • Allowed material 2
  • Allowed material 1
  • Allowed material 2
  • Allowed material 3


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