Specific Process Knowledge/Back-end processing/FlexScribe

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The Cleaver: FlexScribe is designed for cleaving large wafers into smaller pieces from the frontside. Hence it will leave particles on the frontside of the sample. It works by running a "pizza wheel" over the sample and then breaking it in two by using a pair of pliers. The equipment is placed in the left drawer underneath fumehood 5: Special purposes. When operated the the Cleaver: Flex Scribe should always be placed inside Fume hood 5.

Flexscribe.JPG

Approved Materials:

  • Si
  • Quartz
  • Pyrex (Borofloat 33)
  • GaAs
  • InP
  • Sapphire

The Flex Scribe can cleave samples from 100mm down to ~10mm, please contact wetchemistry group for more information

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