LabAdviser/Process flow approval: Difference between revisions

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Before implementing process flows in the DTU Danchip cleanroom facilities, the process needs to be approved by Danchip personnel. The approval is executed to ensure safety to the cleanroom users and to guard involved machinery and equipment during the process, eg for cross-contamination.  
Before implementing process flows in the DTU Danchip cleanroom facilities, the process needs to be approved by Danchip personnel. The approval is executed to ensure safety to the cleanroom users and to guard involved machinery and equipment during the process, eg for cross-contamination.  


Process flows or any questions regarding process flow review should be submitted to '''process_flow@danchip.dtu.dk'''.
Process flows or any questions regarding process flow review should be submitted to '''[mailto:process_flow@danchip.dtu.dk process_flow@danchip.dtu.dk]'''.


=== Recommendations to the setup of the process flow  ===
=== Recommendations to the setup of the process flow  ===

Revision as of 14:52, 27 April 2011

Process Flow Approval

Why do process flows need to be reviewed

Before implementing process flows in the DTU Danchip cleanroom facilities, the process needs to be approved by Danchip personnel. The approval is executed to ensure safety to the cleanroom users and to guard involved machinery and equipment during the process, eg for cross-contamination.

Process flows or any questions regarding process flow review should be submitted to process_flow@danchip.dtu.dk.

Recommendations to the setup of the process flow

  • Process flow: Mark each page of the process flow with title, author, affiliation name, batch number and page number.
  • Illustrations: Supply key process steps with illustrations of top layout and layer layout. If possible, mark the steps that carry a high risk of yield loss.
  • Substrate: Specify the size, type and number of wafers to process and whether wafers should be processed differently.
  • Photolithography: Specify the mask-name used for each photolithography step, and whether alignment should be performed to specific alignment marks. Specify aligner name, exposure dose, type of process (hard contact/soft contact), and the name of developer.
  • Metal evaporation: Specify name of evaporator to use, process name, metal thicknesses and tolerances.
  • Wet/dry etch: specify name of etch/machine, process name, etch parameters and tolerances.
  • Chemicals: if the process includes wet steps carried out in beakers it should be specified how to deposit used chemicals after use.

You can download a template for process-flows here (word format): Process_flow_template.docx‎ We recommend to save a .dotx version of the template to be used as a word-template.