Sputtering of Ti in Wordentec

Feedback to this page: click here

Deposition rate

The deposition rate will change with the settings for pressure and power.

Pressure 1*10^-2 mbar, Power 300 W

The rate in the Wordentec is established to be 1.7 Å/s (in the centre of the wafer, 1.3 Å/s at the edge) (data from before 2018).