Specific Process Knowledge/Thin film deposition/Deposition of Silicon Oxide: Difference between revisions
| Line 63: | Line 63: | ||
| | | | ||
* | * | ||
| | |Not Known | ||
|- | |- | ||
|Film quality | |Film quality | ||
| Line 75: | Line 75: | ||
* | * | ||
| | | | ||
* | |||
|- | |- | ||
|Batch size | |Batch size | ||
| Line 87: | Line 88: | ||
*Deposition time for 1 and 3 wafers are the same | *Deposition time for 1 and 3 wafers are the same | ||
| | | | ||
*1 50mm wafer | |||
*1 100mm wafer | |||
*1 150mm wafer | |||
*1 200mm wafer | |||
*Smaller pieces can be mounted with capton tape | |||
|- | |- | ||
| Substrate material allowed | | Substrate material allowed | ||
| Line 103: | Line 109: | ||
*Quartz | *Quartz | ||
*Metals | *Metals | ||
| | | | ||
*Almost any materials | |||
*not Pb and very poisonous materials | |||
|- | |- | ||
|} | |} | ||