Jump to content

Specific Process Knowledge/Etch/DRIE-Pegasus: Difference between revisions

Jml (talk | contribs)
Jml (talk | contribs)
No edit summary
Line 38: Line 38:
*[[Specific Process Knowledge/Etch/DRIE-Pegasus/SOIetch|SOI etch]]
*[[Specific Process Knowledge/Etch/DRIE-Pegasus/SOIetch|SOI etch]]


== Other processes ==
'''Other etch processes'''


*[[Specific Process Knowledge/Etch/DRIE-Pegasus/nanoetch|Nanoetch]]


*[[Specific Process Knowledge/Etch/DRIE-Pegasus/slopedsidewalls|Etches that produce positively sloped sidewalls for imprinting purposes]]


=== Nanoetching ===
*[[Specific Process Knowledge/Etch/DRIE-Pegasus/Waferthinning| Maskless reduction of wafer thicknesses]]
 
[[Specific Process Knowledge/Etch/DRIE-Pegasus/nanoetch|Nanoetch]]
 
=== Wafer thinning ===
 
=== Sloped sidewalls ===
For injection molding purposes
 
 
== Processing challenges ==
 
=== Bonded wafers ===
 
== User manuals ==
 
* The Danchip user manual from LabManager is found [http://labmanager.danchip.dtu.dk/machine/machine_item.php?refpage=machlist&id=265 >Here<].
* The user manual provided by SPTS can be found here [[Media:SPTS Pegasus user manual.pdf|>HERE<]]


== Hardware information ==
== Hardware information ==