Specific Process Knowledge/Etch/DRIE-Pegasus: Difference between revisions
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*[[Specific Process Knowledge/Etch/DRIE-Pegasus/SOIetch|SOI etch]] | *[[Specific Process Knowledge/Etch/DRIE-Pegasus/SOIetch|SOI etch]] | ||
'''Other etch processes''' | |||
*[[Specific Process Knowledge/Etch/DRIE-Pegasus/nanoetch|Nanoetch]] | |||
*[[Specific Process Knowledge/Etch/DRIE-Pegasus/slopedsidewalls|Etches that produce positively sloped sidewalls for imprinting purposes]] | |||
*[[Specific Process Knowledge/Etch/DRIE-Pegasus/Waferthinning| Maskless reduction of wafer thicknesses]] | |||
[[Specific Process Knowledge/Etch/DRIE-Pegasus/ | |||
== Hardware information == | == Hardware information == | ||