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Specific Process Knowledge/Thin film deposition/thermalevaporator: Difference between revisions

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moved qc info to relevant process info pages
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''*'' ''The variation is defined as (Max-Min)/Average for the various points measured on the wafer. The max. point was around the center and the min. somewhere along the edge. The exact location of the maximum thickness depends how the sample is placed relative to the point of maximum material flux. Measurement by Rebecca Ettlinger, Nov. 2018.''
''*'' ''The variation is defined as (Max-Min)/Average for the various points measured on the wafer. The max. point was around the center and the min. somewhere along the edge. The exact location of the maximum thickness depends how the sample is placed relative to the point of maximum material flux. Measurement by Rebecca Ettlinger, Nov. 2018.''
==Quality control (QC) procedure for the Thermal evaporator==
{| border="1" cellspacing="2" cellpadding="2" colspan="3"
|bgcolor="#98FB98" |'''Quality control (QC) for the Thermal evaporator'''
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*[http://labmanager.dtu.dk/d4Show.php?id=6654&mach=404 QC procedure for the Thermal Evaporator]<br>
*[https://labmanager.dtu.dk/view_binary.php?type=data&mach=404 The newest QC data for the Thermal evaporator]<br>
{| {{table}}
| align="center" |
{| border="1" cellspacing="1" cellpadding="2"  align="center" style="width:400px"
! QC Recipe:
! Al
! Ag
|-
|Deposition rate
|1 Å/s
|5 Å/s
|-
|Thickness
|150 nm
|150 nm
|-
|Pressure
|Below 1*10<sup>-5</sup> Torr
|Below 1*10<sup>-5</sup> Torr
|-
|}
| align="center" valign="top"|
{| border="2" cellspacing="1" cellpadding="2" align="center" style="width:440px"
!QC limits
!Temescal
|-
|Measured average thickness
|± 20 %
|-
|Deposition rate deviation
|± 50 % after stabilizing
|-
|Thickness deviation across a 4" wafer
|± 30 %
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Thicknesses are measured in 5 points with one of the Dektak instruments. <br>
Additionally we monitor the state of the Al crucible and ensure that it does not contain too much Al as this can wet the outside and short circuit the heater.
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