Specific Process Knowledge/Etch/DRIE-Pegasus/Pegasus-2/Si Nano etching: Difference between revisions

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The CORE sequence (meaning Clear, Oxidize, Remove and Etch) is a fluorocarbon-free directional plasma etch procedure that enables a higher selectivity, creates pattern independence of etching profiles and works excellent at room temperature. The CORE process resembles the well-known SF6-based Bosch process, but the usual C4F8 inhibitor is replaced by O2 oxidation with self-limiting characteristics. Therefore the CORE result is similar to Bosch, however has the advantage of preventing the pile-up of fluorocarbon deposits at the topside of deep-etched or nano-sized features. At the same time, process drift is minimized as the reactor wall is staying perfectly clean. The CORE process has shown an excellent performance in high aspect ratio (3D) nanoscale structures with an accurate and controllable etch rate between 1 and 50 nm min−1 (and SiO2-selectivity of ca. 35) using the etch-tool in the RIE-mode. By adding the ICP source (DRIE-mode), a directional etch rate up to 1 μm min−1 (at 50 sccm SF6 flow) and selectivity >200 for SiO2 is possible.

1. 3D silicon photonic crystal membranes.

1. 3D silicon photonic crystal membranes.

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 [mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Etch/DRIE-Pegasus/Pegasus-2/Si_Nano_etching click here]'''
-Below are images illustrating works that have been done during the ph.d. projects.
+The CORE sequence (meaning Clear, Oxidize, Remove and Etch) is a fluorocarbon-free directional plasma etch procedure that enables a higher selectivity, creates pattern independence of etching profiles and works excellent at room temperature. The CORE process resembles the well-known SF6-based Bosch process, but the usual C4F8 inhibitor is replaced by O2 oxidation with self-limiting characteristics. Therefore the CORE result is similar to Bosch, however has the advantage of preventing the pile-up of fluorocarbon deposits at the topside of deep-etched or nano-sized features. At the same time, process drift is minimized as the reactor wall is staying perfectly clean. The CORE process has shown an excellent performance in high aspect ratio (3D) nanoscale structures with an accurate and controllable etch rate between 1 and 50 nm min−1 (and SiO2-selectivity of ca. 35) using the etch-tool in the RIE-mode. By adding the ICP source (DRIE-mode), a directional etch rate up to 1 μm min−1 (at 50 sccm SF6 flow) and selectivity >200 for SiO2 is possible.
 <gallery caption="" widths="380px" heights="300px" perrow="3">
-image:3D.png| 1. 3D silicon photonic crystal membranes.
+image:The CORE recipe.png| 1. 3D silicon photonic crystal membranes.
-image:Scallops.png| 2. Comparison of scallops by traditional Bosch process and modified DREM process.
-image:3Dmicro.png| 3. 3D silicon microstructures fabricated by DREM process.
-image:SiZnO.png| 4. 3D silicon micro-mesh structures integrated with ZnO nanowires for photocatalysis and photocurrent generation.
-image:SiNanoColor.png| 5. 3D silicon stacked nanowires for structural color generation.
-image:SiMicroPillars.png| 6. High aspect ratio silicon micropillars fabricated with DREM process.
-image:ZIF8.png| 7. ZIF-8 crystals for tunable structural colors.
-image:FConPegasus.png| 8. Using OES to monitor the fluorocarbon film deposition with Pegasus 1.
 </gallery>