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Specific Process Knowledge/Thin film deposition/Deposition of Titanium: Difference between revisions

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DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, NLAB-Nlab347-labadviser-users-35231
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Reet (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, NLAB-Nlab347-labadviser-users-35231
1,760 edits
→Titanium deposition: added cluster sputterer
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! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]])
! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]])
! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Lesker|Lesker]])
! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Lesker|Lesker]])
! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Cluster-based_multi-chamber_high_vacuum_sputtering_deposition_system#Process_information|Cluster-based sputter system]])
|-  
|-  


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|E-beam deposition of Titanium
|E-beam deposition of Titanium
|E-beam deposition of Titanium
|E-beam deposition of Titanium
|Sputter deposition of Titanium
|Sputter deposition of Titanium
|Sputter deposition of Titanium
|Sputter deposition of Titanium
|Sputter deposition of Titanium
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|RF Ar clean
|RF Ar clean
|
|
|RF Ar clean
|RF Ar clean
|RF Ar clean
|RF Ar clean
|RF Ar clean
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|10Å to 1 µm*
|10Å to 1 µm*
|10Å to 1000Å
|10Å to 1000Å
|.
|.
|.
|.
|.
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|Depending on process parameters, see [[Sputtering of Ti in Wordentec|here]].
|Depending on process parameters, see [[Sputtering of Ti in Wordentec|here]].
|Depending on process parameters, about 1 Å/s.
|Depending on process parameters, about 1 Å/s.
|Depending on process parameters
|-
|-


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* Up to 1x6" wafers  
* Up to 1x6" wafers  
|
|
*Up to 10x4" or 6" wafers
*Many smaller pieces


|-style="background:LightGrey; color:black"
|-style="background:LightGrey; color:black"
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* Pyrex wafers  
* Pyrex wafers  
|
|
* Silicon wafers
*Almost any as long as they do not degas at the substrate temperature used for your process. See cross-contamination sheets.
* Quartz wafers
|
* Pyrex wafers
*Almost any as long as they do not degas at the substrate temperature used for your process. See cross-contamination sheets.
|-
|-
|-style="background:WhiteSmoke; color:black"
|-style="background:WhiteSmoke; color:black"
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* Metals  
* Metals  
|
|
* Silicon oxide
Almost any as for substrates
* Silicon (oxy)nitride
|
* Photoresist
Almost any as for substrates
* Metals
 
|-style="background:LightGrey; color:black"
|-style="background:LightGrey; color:black"
! Comment
! Comment
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|}
|}
'''*'''  ''For thicknesses above 600 nm please write to metal@danchip.dtu.dk to ensure that there is enough material available.''
'''*'''  ''For thicknesses above 600 nm please write to metal@nanotech.dtu.dk to ensure that there is enough material available.''


== Comments: Adhesion layer ==
== Comments: Adhesion layer ==
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