Specific Process Knowledge/Thin film deposition/Temescal: Difference between revisions
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'''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/... click here]''' | |||
<!-- Replace "http://labadviser.danchip.dtu.dk/..." wih the link to the Labadviser page--> | |||
== Name of equipment == | |||
Write a short description of the equipment(s). | |||
[[image:Cluster1.jpg|200x200px|right|thumb|Image(s) of the equipment(s)]] | |||
'''The user manual(s), quality control procedure(s) and results, user APV(s), technical information and contact information can be found in LabManager:''' | |||
<!-- remember to remove the type of documents that are not present --> | |||
<!-- give the link to the equipment info page in LabManager: --> | |||
[http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=326 RIE1 in LabManager] | |||
== Process information == | |||
Link to process pages - e.g. one page for each material | |||
Example: | |||
*[[Specific Process Knowledge/Etch/Etching of Silicon/Si etch using RIE1 or RIE2|Etch of silicon using RIE]] | |||
*[[Specific Process Knowledge/Etch/Etching of Silicon Oxide/SiO2 etch using RIE1 or RIE2|Etch of silicon oxide using RIE]] | |||
*[[Specific Process Knowledge/Etch/Etching of Silicon Nitride/Etch of Silicon Nitride using RIE|Etch of silicon nitride using RIE]] | |||
*[[Specific Process Knowledge/Etch/Etching of Polymer/Etch of Photo Resist using RIE|Etch of photo resist using RIE]] | |||
==Equipment performance and process related parameters== | |||
{| border="2" cellspacing="0" cellpadding="2" | |||
!colspan="2" border="none" style="background:silver; color:black;" align="center"|Equipment | |||
|style="background:WhiteSmoke; color:black"|<b>Equipment 1</b> | |||
|style="background:WhiteSmoke; color:black"|<b>Equipment 2</b> | |||
|- | |||
!style="background:silver; color:black;" align="center" width="60"|Purpose | |||
|style="background:LightGrey; color:black"| | |||
|style="background:WhiteSmoke; color:black"| | |||
*Purpose 1 | |||
*Purpose 2 | |||
|style="background:WhiteSmoke; color:black"| | |||
*Purpose 1 | |||
*Purpose 2 | |||
*Purpose 3 | |||
|- | |||
!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Performance | |||
|style="background:LightGrey; color:black"|Response 1 | |||
|style="background:WhiteSmoke; color:black"| | |||
*Performance range 1 | |||
*Performance range 2 | |||
|style="background:WhiteSmoke; color:black"| | |||
*Performance range 1 | |||
*Performance range 2 | |||
*Performance range 3 | |||
|- | |||
|style="background:LightGrey; color:black"|Response 2 | |||
|style="background:WhiteSmoke; color:black"| | |||
*Performance range | |||
|style="background:WhiteSmoke; color:black"| | |||
*Performance range | |||
|- | |||
!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Process parameter range | |||
|style="background:LightGrey; color:black"|Parameter 1 | |||
|style="background:WhiteSmoke; color:black"| | |||
*Range | |||
|style="background:WhiteSmoke; color:black"| | |||
*Range | |||
|- | |||
|style="background:LightGrey; color:black"|Parameter 2 | |||
|style="background:WhiteSmoke; color:black"| | |||
*Range | |||
|style="background:WhiteSmoke; color:black"| | |||
*Range | |||
|- | |||
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates | |||
|style="background:LightGrey; color:black"|Batch size | |||
|style="background:WhiteSmoke; color:black"| | |||
*<nowiki>#</nowiki> small samples | |||
*<nowiki>#</nowiki> 50 mm wafers | |||
*<nowiki>#</nowiki> 100 mm wafers | |||
*<nowiki>#</nowiki> 150 mm wafers | |||
|style="background:WhiteSmoke; color:black"| | |||
*<nowiki>#</nowiki> small samples | |||
*<nowiki>#</nowiki> 50 mm wafers | |||
*<nowiki>#</nowiki> 100 mm wafers | |||
*<nowiki>#</nowiki> 150 mm wafers | |||
|- | |||
| style="background:LightGrey; color:black"|Allowed materials | |||
|style="background:WhiteSmoke; color:black"| | |||
*Allowed material 1 | |||
*Allowed material 2 | |||
|style="background:WhiteSmoke; color:black"| | |||
*Allowed material 1 | |||
*Allowed material 2 | |||
*Allowed material 3 | |||
|- | |||
|} | |||
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Revision as of 10:53, 17 May 2018
THIS PAGE IS UNDER CONSTRUCTION
=<span style="background:#FF2800">THIS PAGE IS UNDER CONSTRUCTION</span>[[image:Under_construction.png|200px]]=
Template
Feedback to this page: click here
Name of equipment
Write a short description of the equipment(s).
The user manual(s), quality control procedure(s) and results, user APV(s), technical information and contact information can be found in LabManager:
Process information
Link to process pages - e.g. one page for each material
Example:
- Etch of silicon using RIE
- Etch of silicon oxide using RIE
- Etch of silicon nitride using RIE
- Etch of photo resist using RIE
Equipment | Equipment 1 | Equipment 2 | |
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Purpose |
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Performance | Response 1 |
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Response 2 |
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Process parameter range | Parameter 1 |
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Parameter 2 |
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Substrates | Batch size |
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Allowed materials |
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