Specific Process Knowledge/Lithography/UVExposure: Difference between revisions

Revision as of 11:22, 1 November 2017

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UV Exposure Comparison Table

Equipment		KS Aligner	Aligner: MA6 - 2	Aligner: 6inch	Aligner: Maskless 01	Inclined UV Lamp
Purpose		Top Side Alignment Back Side Alignment UV exposure	Top Side Alignment Back Side Alignment UV exposure (DUV exposure) Bond alignment	Top Side Alignment Back Side Alignment UV exposure	Top Side Alignment Direct UV writing	UV exposure DUV exposure
Performance	Minimum feature size	1.25µm down to 1.0µm	1.25µm down to 0.5µm	1.25µm	3µm
	Exposure light/filters/spectrum	350W Hg lamp i-line filter (365nm notch filter), intensity in Constant Intensity mode: 7mW/cm² @ 365nm 303nm filter optional	500W Hg-Xe lamp i-line filter (365nm notch filter), intensity in Constant Intensity mode: ~13mW/cm² @ 365nm UV350 optics optional UV250 optics optional	350W Hg lamp SU8 filter (long-pass), intensity in Constant Power mode: 7mW/cm² @ 365nm i-line filter optional	365nm LED	1000 W Hg-Xe lamp near UV (350-450nm), mid UV (260-320nm), and deep UV (220-260nm)
	Exposure mode	proximity, soft, hard, vacuum contact	proximity, soft, hard, vacuum contact	proximity, soft, hard, vacuum contact	Direct writing	Flood exposure Proximity exposure with home-made chuck and maskholder
Substrates	Batch size	1 small sample 1 50 mm wafer 1 100 mm wafer 1 150 mm wafer	1 small sample 1 50 mm wafer 1 100 mm wafer 1 150 mm wafer	1 50 mm wafers 1 100 mm wafers 1-25 150 mm wafers with automatic handling	1 small sample, down to 5x5 mm² 1 50 mm wafer 1 100 mm wafer 1 150 mm wafer	all sizes up to 8inch
	Allowed materials	All cleanroom materials except copper and steel Dedicated 2inch chuck for III-V materials	All cleanroom materials except copper and steel Dedicated chuck for III-V materials	All cleanroom materials except III-V materials, copper and steel substrates, and type IV films	Silicon Glass	All cleanroom materials

KS Aligner

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SUSS Mask Aligner MA6 is designed for high resolution photolithography. The 365nm exposure wavelength version is capable of 1.25 (1.0) um resolution in vacuum contact. All contact exposure programs (vacuum, hard, soft, proximity) are supplied. Two alignment options are available: top side alignment (TSA) with a split field or a video microscope and back side alignment (BSA) with BSA microscope. It is also possible to make IR- light alignment.

Training videos: Operation Alignment (on Aligner: MA6-2, but KS Aligner is the same model)

The user manual(s), quality control procedure(s) and results and contact information can be found in LabManager.

Process information

The KS Aligner has an i-line notch filter installed. This results in an exposure light peak around 365nm with a FWHM of 7nm. Dependent on the spectral sensitivity of the resist, the optimal dose may be increased compared to broadband exposure on the Aligner-6inch.

Information on UV exposure dose

Equipment performance and process related parameters

Purpose		Alignment and UV exposure
Performance	Exposure mode	vacuum contact, hard contact, soft contact, proximity, flood exposure
	Exposure light/filters	broadband (i-, g-, h-line) 365 nm (i-line) 303 nm
	Minimum structure size	down to 1.25µm
	Mask size	5x5 inch 7x7 inch special holder for 4 x 2" designs on 5x5 inch
	Alignment modes	Top side (TSA) Backside (BSA)
Substrates	Substrate size	small pieces 1x1cm 50 mm wafers 100 mm wafers 150 mm wafers
	Allowed materials	All cleanroom materials except copper and steel Dedicated chuck for III-V materials
	Batch	1

Aligner: MA6 - 2

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The Süss MicroTek Mask Aligner MA6 is designed for high resolution photolithography. The 365nm exposure wavelength version is capable of 1.25 (1.0) um resolution in vacuum contact. All contact exposure programs (vacuum, low vacuum, hard, soft, proximity) are supplied. Two alignment options are available: top side alignment (TSA) with a split field or a video microscope and back side alignment (BSA) with BSA (video) microscope.

The aligner can also be used for bond alignment (for Wafer Bonder 02). Special training is required.

Training videos: Operation Alignment

The user manual, APV, and contact information can be found in LabManager.

Process information

The Aligner: MA6 - 2 has an i-line notch filter installed. This results in an exposure light peak at 365nm. Compared to exposure on the KS Aligner, the optimal dose should be very similar. Dependent on the spectral sensitivity of the resist, the optimal dose may be increased compared to broadband exposure on the Aligner-6inch.

The 500W Hg-Xe lamp also enables exposure in the DUV range around 240nm. This functionality is not established yet, partly due to safety concerns.

Information on UV exposure dose

Equipment performance and process related parameters

Purpose		Mask alignment and UV exposure, potentially DUV exposure ¹⁾ Bond alignment
Performance	Exposure mode	vacuum contact, hard contact, soft contact, proximity, flood exposure
	Exposure light/filters	broadband (i-, g-, h-line) 365 nm (i-line) "UV300" (280-350 nm) DUV (240 nm) ¹⁾
	Minimum structure size	Typically 1.25 µm, possibly down to 0.8 µm ¹⁾
	Mask size	5x5 inch 7x7 inch special holder for 4 x 2" designs on 5x5 inch
	Alignment modes	Top side (TSA) Backside (BSA)
Substrates	Substrate size	small pieces 1x1cm 50 mm wafers 100 mm wafers 150 mm wafers
	Allowed materials	All cleanroom materials except copper and steel Dedicated chuck for III-V materials
	Batch	1

¹⁾ Not available yet.

Aligner-6inch

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Aligner-6inch, EVG620 aligner, is designed for high resolution photolithography. The machine can be used for 2, 4 and 6 inch substrates. Cassette-to-cassette handling option is available only for 6inch substrates. The automatic pattern recognition software is available for the special alignment marks design recommended of EVGroup. Please contact Danchip staff for further information. Available exposure mode: proximity, soft, hard and vacuum contact. Two alignment options are available: top side alignment (TSA) and back side alignment (BSA). IR-light alignment also an option.

The user manual(s), quality control procedure(s) and results and contact information can be found in LabManager

Process information

The Aligner-6inch has a long pass filter designed for SU-8 exposure installed. The SU-8 filter has no transmission in the 250-330nm range, and close to full transmission in the 400-500nm range. In the 350-370nm range, the transmission is approximately 0.5. This results in a broadband exposure light consisting of the i-line (365nm), the h-line (405nm), and the g-line (435nm) from the Hg spectrum. Dependent on the spectral sensitivity of the resist, the optimal dose may be decreased compared to i-line exposure on the KS-Aligner.

Information on UV exposure dose

Equipment performance and process related parameters

Purpose		Alignment and UV exposure, potentially DUV exposure
Performance	Exposure mode	vacuum contact, hard contact, soft contact, proximity, flood exposure
	Exposure light/filters	broadband (i-, g-, h-line) SU8 filter (½i-, g-, h-line) 365 nm (i-line)
	Minimum structure size	down to 1.25µm
	Mask size	5x5 inch 7x7 inch
	Alignment modes	Top side (TSA) Backside (BSA)
Substrates	Substrate size	50 mm wafers 100 mm wafers 150 mm wafers
	Allowed materials	All substrates except III-V, copper, and steel All films except type IV
	Batch	1

Aligner: Maskless 01

This section is under construction

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The MLA 100 Maskless Aligner located in the E-5 cleanroom is a direct write lithography tool. It is UV LED exposure system, that exposes the patterns directly on photosensitive resists on chips, 2, 4, and 6 inch substrates, without prior fabrication of the mask. The system offers an alignment option with high accuracy.

The user manual and contact information can be found in LabManager: Equipment info in LabManager

Equipment performance and process related parameters

Purpose		Alignment and UV exposure
Performance	Exposure mode	Direct writing
	Exposure light/filters	365nm (LED), FWHM=8nm
	Minimum structure size	down to 3µm
	Design formats	GDS-II DXF CIF Gerber HIMT format
	Alignment modes	Top side only
Substrates	Substrate size	150 mm wafer 100 mm wafer 50 mm wafer pieces down to 5x5 mm²
	Allowed materials	Silicon and glass
	Batch	1

Inclined UV Lamp

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The Inclined UV lamp is 1000 W Hg(Xe)lamp source designed for near UV, 350-450nm, mid UV, 260-320nm, and deep UV, 220-260nm exposures of resists and polymers. The exposure source can be also used to make an inclined exposure in air or in the media tank.

The tool was purchased in February 2009 from Newport. The exposure lamp has a official name: Oriel Flood Exposure Source, unit 92540. All other parts of equipment: substrate and mask holder with media tank, exhaust box around the tool, timer controller, were designed and build at DTU Danchip workshop.

The substrate and mask holder with a media tank was designed as part of Master Thesis of DTU Nanotech, Andres Kristensen group. The exhaust box was made as part of safety and the timer controller was build to control exposure time.

The technical specification and the general outline of the equipment can be found in LabManager.

The user manual(s), quality control procedure(s) and results and contact information can be found in LabManager.

Equipment performance and process related parameters

Purpose		UV exposure
Performance	Exposure mode	Flood exposure Proximity exposure with mask possible for 4inch substrate
	Exposure light/filters	Near UV(350-450nm) Mid UV (260-320nm) Deep UV(220-260nm)
	Minimum structure size
	Mask size	5x5inch optinal
	Alignment modes	No alignment possible
Substrates	Substrate size	Up to 8inch substrates, different shapes
	Allowed materials	All cleanroom materials
	Batch	1