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| == Choose material to deposit == | | == Choose material to deposit == |
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| === Dielectrica ===
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| *[[/Deposition of Silicon Nitride|Silicon Nitride]] - ''Silicon nitride and silicon oxynitride''
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| *[[/Deposition of Silicon Oxide|Silicon Oxide]]
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| *[[/Deposition of Titanium Oxide|Titanium Oxide]]
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| === Metals/elements ===
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| {| border="2" cellspacing="1" cellpadding="8"
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| |-
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| Period/Group
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| |IVB
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| |VB
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| |VIB
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| |VIIIB
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| |IB
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| |IIIA
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| |IVA
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| |-
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| |3
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| |[[/Deposition of Aluminium|13 Al Aluminium]]
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| |[[/Deposition of Silicon|14 Si Silicon]]
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| |-
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| |4
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| |[[/Deposition of Titanium|22 Ti Titanium]]
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| |[[/Deposition of Chromium|24 Cr Chromium]]
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| |[[/Deposition of Nickel|28 Ni Nickel]]
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| |[[/Deposition of Copper|29 Cu Copper]]
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| |[[/Deposition of Germanium|32 Ge Germanium]]
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| |5
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| |[[/Deposition of Molybdenum|42 Mo Molybdenum]]
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| |[[/Deposition of Palladium|46 Pd Palladium]]
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| |[[/Deposition of Silver|47 Ag Silver]]
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| |[[/Deposition of Tin|50 Sn Tin]]
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| |6
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| |[[/Deposition of Tantalum|73 Ta Tantalum]]
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| |[[/Deposition of Tungsten|74 W Tungsten]]
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| |[[/Deposition of Platinum|78 Pt Platinum]]
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| |[[/Deposition of Gold|79 Au Gold]]
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| |-
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| |}
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| ===Alloys===
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| *[[/Deposition of TiW|TiW]] alloy (10%/90% by weight)
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| *[[/Deposition of NiCr|NiCr]] alloy
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| *[[/Deposition of AlTi|AlTi]] alloy
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| *[[/Deposition of NiV|NiV]] alloy
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| === Polymers ===
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| *[[Specific Process Knowledge/Photolithography/SU8|SU8]]
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| *[[/Antistiction Coating|Antistiction Coating]]
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| *Topas
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| *PMMA
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| == Choose deposition equipment == | | == Choose deposition equipment == |
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| *[[/Alcatel|Alcatel]] - ''E-beam evaporator and sputter tool''
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| *[[/Lesker|Lesker]] - ''Sputter tool''
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| *[[/Multisource_PVD|PVD co-sputter/evaporation]] - ''E-beam evaporator and multiple wafer tool''
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| *[[/Wordentec|Wordentec]] - ''E-beam evaporator, sputter and thermal evaporator''
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| *[[Specific Process Knowledge/III-V Process/thin film dep/physimeca|Physimeca]] - ''E-beam evaporator (III-V lab)''
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| *[[Specific Process Knowledge/Etch/IBE⁄IBSD Ionfab 300|IBE/IBSD Ionfab 300]] - ''Sputter deposition of high quality optical layers and milling/etching''
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| *[[/Hummer|Hummer]] - ''Gold sputtering system''
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| *[[/PECVD|PECVD]] - ''Plasma Enhanced Chemical Vapor deposition''
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| *[[Specific_Process_Knowledge/Thin_film_deposition/Deposition_of_Silicon_Nitride/Deposition_of_Silicon_Nitride_using_LPCVD|Furnace LPCVD Nitride (4" and 6")]] - ''Deposition of silicon nitride''
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| *[[/Furnace LPCVD PolySilicon|Furnace LPCVD Polysilicon (4" and 6")]] - ''Deposition of polysilicon''
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| *[[/Furnace LPCVD TEOS|Furnace LPCVD TEOS (4")]] - ''Deposition of silicon oxide''
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| *[[/MVD|MVD]] - ''Molecular Vapor Deposition''
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| *[[/Black Magic PECVD|Black Magic PECVD]] - ''Black Magic PECVD (Carbon)''
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| *[[/Electroplating-Ni|Electroplating-Ni]] - ''Electrochemical deposition of nickel''
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| = Section under construction [[Image:section under construction.jpg|70px]] = | | = Section under construction [[Image:section under construction.jpg|70px]] = |
3rd Level - Material/Methode
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Choose material to deposit
Choose deposition equipment
Section under construction 
