Revision as of 09:53, 15 October 2013

3rd Level - Material/Methode

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Choose material to deposit

Dielectrica

Silicon Nitride - Silicon nitride and silicon oxynitride
Silicon Oxide
Titanium Oxide

Metals/elements

Period/Group	IVB	VB	VIB	VIIIB	IB	IIIA	IVA
3	.	.	.	.	.	13 Al Aluminium	14 Si Silicon
4	22 Ti Titanium	.	24 Cr Chromium	28 Ni Nickel	29 Cu Copper	.	32 Ge Germanium
5	.	.	42 Mo Molybdenum	46 Pd Palladium	47 Ag Silver	.	50 Sn Tin
6	.	73 Ta Tantalum	74 W Tungsten	78 Pt Platinum	79 Au Gold	.	.

Alloys

TiW alloy (10%/90% by weight)
NiCr alloy
AlTi alloy

Polymers

SU8
Antistiction coating
Topas
PMMA

Choose deposition equipment

Alcatel - E-beam evaporator and sputter tool
Lesker - Sputter tool
PVD co-sputter/evaporation - E-beam evaporator and multiple wafer tool
Wordentec - E-beam evaporator, sputter and thermal evaporator
Physimeca - E-beam evaporator (III-V lab)
IBE/IBSD Ionfab 300 - Sputter deposition of high quality optical layers and milling/etching
Hummer - Gold sputtering system
PECVD - Plasma Enhanced Chemical Vapor deposition
Furnace LPCVD Nitride (4" and 6") - Deposition of silicon nitride
Furnace LPCVD Polysilicon (4" and 6") - Deposition of polysilicon
Furnace LPCVD TEOS (4") - Deposition of silicon oxide
MVD - Molecular Vapor Deposition
Black Magic PECVD - Black Magic PECVD (Carbon)
Electroplating-Ni - Electrochemical deposition of nickel

Section under construction

Dielectrica	Semicondutors	Metals	Alloys	Polymers
Silicon Nitride - and oxynitride Silicon Oxide Titanium Oxide	Silicon	Aluminium Titanium Chromium Nickel Copper Germanium Molybdenum Palladium Silver Tin Tantalum Tungsten Platinum Gold	TiW alloy (10%/90% by weight) NiCr alloy AlTi alloy	SU8 Antistiction coating Topas PMMA

PVD	LPCVD	PECVD	Coaters	Others
Silicon Nitride - and oxynitride Silicon Oxide Titanium Oxide	Silicon	Aluminium Titanium Chromium Nickel Copper Germanium Molybdenum Palladium Silver Tin Tantalum Tungsten Platinum Gold	TiW alloy (10%/90% by weight) NiCr alloy AlTi alloy	SU8 Antistiction coating Topas PMMA

@@ Line 100: / Line 100: @@
 | align="left" valign="top" style="background:#DCDCDC;"|''' Alloys'''
 | align="left" valign="top" style="background:LightGray"|''' Polymers'''
+|-valign="top"
+|style="background: LightGray"|
+[[/Deposition of Silicon Nitride|Silicon Nitride]] - ''and oxynitride'' <br/>
+[[/Deposition of Silicon Oxide|Silicon Oxide]]<br/>
+[[/Deposition of Titanium Oxide|Titanium Oxide]]<br/>
+|style="background: #DCDCDC"|
+[[/Deposition of Silicon|Silicon]]
+|style="background: LightGray"|
+[[/Deposition of Aluminium|Aluminium]] <br/>
+[[/Deposition of Titanium|Titanium]]<br/>
+[[/Deposition of Chromium|Chromium]]<br/>
+[[/Deposition of Nickel|Nickel]]<br/>
+[[/Deposition of Copper|Copper]]<br/>
+[[/Deposition of Germanium|Germanium]]<br/>
+[[/Deposition of Molybdenum|Molybdenum]]<br/>
+[[/Deposition of Palladium|Palladium]]<br/>
+[[/Deposition of Silver|Silver]]<br/>
+[[/Deposition of Tin|Tin]]<br/>
+[[/Deposition of Tantalum|Tantalum]]<br/>
+[[/Deposition of Tungsten|Tungsten]]<br/>
+[[/Deposition of Platinum|Platinum]]<br/>
+[[/Deposition of Gold|Gold]]<br/>
+|style="background: #DCDCDC"|
+[[/Deposition of TiW|TiW]] alloy (10%/90% by weight) <br/>
+[[/Deposition of NiCr|NiCr]] alloy  <br/>
+[[/Deposition of AlTi|AlTi]] alloy
+|style="background: LightGray"|
+[[Specific Process Knowledge/Photolithography/SU8|SU8]]<br/>
+Antistiction coating <br/>
+Topas <br/>
+PMMA
+|-
+|}
+{| {{table}}
+| align="left" valign="top"  style="background:LightGray"|''' PVD'''
+| align="left" valign="top" style="background:#DCDCDC;"|''' LPCVD'''
+| align="left" valign="top" style="background:LightGray"|''' PECVD'''
+| align="left" valign="top" style="background:#DCDCDC;"|''' Coaters'''
+| align="left" valign="top" style="background:LightGray"|''' Others'''
 |-valign="top"
 |style="background: LightGray"|