Specific Process Knowledge/Thin film deposition/Deposition of Titanium: Difference between revisions
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Revision as of 14:45, 26 September 2011
Titanium can be deposited by e-beam evaporation. In the chart below you can compare the different deposition equipment.
| E-beam evaporation (Alcatel) | E-beam evaporation (Wordentec) | E-beam evaporation (PVD co-sputter/evaporation) | Sputter deposition (Wordentec) | |
|---|---|---|---|---|
| Batch size |
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|
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| Pre-clean | RF Ar clean | RF Ar clean | RF Ar clean | RF Ar clean |
| Layer thickness | 10Å to 1µm | 10Å to 1 µm | 10Å to 1000Å | . |
| Deposition rate | 2Å/s to 15Å/s | 10Å/s to 15Å/s | About 1Å/s | Depending on process parameters, see here. |