Specific Process Knowledge/Thin film deposition/Deposition of Titanium: Difference between revisions
No edit summary |
No edit summary |
||
| Line 6: | Line 6: | ||
! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Alcatel|Alcatel]]) | ! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Alcatel|Alcatel]]) | ||
! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]]) | ! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]]) | ||
! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Multisource PVD|PVD co-sputter/evaporation]]) | |||
! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]]) | ! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]]) | ||
|- | |- | ||
| Line 16: | Line 17: | ||
*6x4" wafers or | *6x4" wafers or | ||
*6x6" wafers | *6x6" wafers | ||
| | |||
*4x6" wafers or | |||
*4x4" wafers or | |||
*2x6" wafers | |||
| | | | ||
*24x2" wafers or | *24x2" wafers or | ||
| Line 22: | Line 27: | ||
|- | |- | ||
| Pre-clean | | Pre-clean | ||
|RF Ar clean | |||
|RF Ar clean | |RF Ar clean | ||
|RF Ar clean | |RF Ar clean | ||
| Line 29: | Line 35: | ||
|10Å to 1µm | |10Å to 1µm | ||
|10Å to 1 µm | |10Å to 1 µm | ||
|10Å to 1000Å | |||
|. | |. | ||
|- | |- | ||
| Line 34: | Line 41: | ||
|2Å/s to 15Å/s | |2Å/s to 15Å/s | ||
|10Å/s to 15Å/s | |10Å/s to 15Å/s | ||
|About 1Å/s | |||
|Depending on process parameters, see [[Sputtering of Ti in Wordentec|here]]. | |Depending on process parameters, see [[Sputtering of Ti in Wordentec|here]]. | ||
|- | |- | ||