Specific Process Knowledge/Thin film deposition/Deposition of Titanium: Difference between revisions
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|. | |Depending on process parameters, see [[Sputtering of Ti in Wordentec|here]]. | ||
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Revision as of 11:54, 8 September 2009
Titanium can be deposited by e-beam evaporation. In the chart below you can compare the different deposition equipment.
| E-beam evaporation (Alcatel) | E-beam evaporation (Leybold) | E-beam evaporation (Wordentec) | Sputter deposition (Wordentec) | |
|---|---|---|---|---|
| Batch size |
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| Pre-clean | RF Ar clean | Ar ion bombartment | RF Ar clean | RF Ar clean |
| Layer thickness | 10Å to 1µm | 10Å to 0.5µm | 10Å to 1 µm | . |
| Deposition rate | 2Å/s to 15Å/s | 1Å/s to 5Å/s | 10Å/s to 15Å/s | Depending on process parameters, see here. |