Sputtering of Ti in Wordentec: Difference between revisions

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== Deposition rate ==
== Deposition rate ==

Revision as of 13:40, 19 March 2020

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Deposition rate

The deposition rate will change with the settings for pressure and power.


Pressure 1*10-2 mbar, Power 300 W

The rate in the Wordentec is established to be 1.7 Å/s (in the centre of the wafer, 1.3 Å/s at the edge) (data from before 2018).

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