Specific Process Knowledge/Thin film deposition/Wordentec: Difference between revisions
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'''*''' ''For e-beam evaporation and sputtering, permission is required for thicknesses above 600 nm. For thermal evaporation, permission is required for thicknesses above 120 nm. This is to ensure that there will be enough material present. Contact metal@danchip.dtu.dk or thinfilm@danchip.dtu.dk'' | '''*''' ''For e-beam evaporation and sputtering, permission is required for thicknesses above 600 nm. For thermal evaporation, permission is required for thicknesses above 120 nm. This is to ensure that there will be enough material present. Contact metal@danchip.dtu.dk or thinfilm@danchip.dtu.dk'' | ||
'''**''' ''Percent variation calculated as (Max-Min)/Average. For thermally evaporated Al, the max was on one side of the wafer rather than in the middle.'' | '''**''' ''Percent variation calculated as (Max-Min)/Average. For thermally evaporated Al, the max was on one side of the wafer rather than in the middle. Measured by Rebecca Ettlinger in 2018.'' | ||
== Quality control (QC) for Wordentec== | == Quality control (QC) for Wordentec== | ||