Specific Process Knowledge/Thin film deposition/Wordentec: Difference between revisions
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'''*''' ''For e-beam evaporation and sputtering, permission is required for thicknesses above 600 nm. For thermal evaporation, permission is required for thicknesses above 120 nm. This is to ensure that there will be enough material present. Contact metal@danchip.dtu.dk or thinfilm@danchip.dtu.dk'' | '''*''' ''For e-beam evaporation and sputtering, permission is required for thicknesses above 600 nm. For thermal evaporation, permission is required for thicknesses above 120 nm. This is to ensure that there will be enough material present. Contact metal@danchip.dtu.dk or thinfilm@danchip.dtu.dk'' | ||
'''**''' ''% variation calculated as (Max-Min)/Average. Note that for thermally evaporated Al, the max was on one side of the wafer and the minimum directly opposite.'' | '''**''' ''% variation calculated as (Max-Min)/Average. Note that for thermally evaporated Al, the max was on one side of the wafer and the minimum directly opposite.'' | ||