Specific Process Knowledge/Thin film deposition/Deposition of Titanium: Difference between revisions
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! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]]) | ! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]]) | ||
! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Lesker|Lesker]]) | ! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Lesker|Lesker]]) | ||
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|Sputter deposition of Titanium | |Sputter deposition of Titanium | ||
|Sputter deposition of Titanium | |Sputter deposition of Titanium | ||
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|RF Ar clean | |RF Ar clean | ||
|RF Ar clean | |RF Ar clean | ||
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|Depending on process parameters, see [[Sputtering of Ti in Wordentec|here]]. | |Depending on process parameters, see [[Sputtering of Ti in Wordentec|here]]. | ||
|Depending on process parameters, about 1 Å/s. | |Depending on process parameters, about 1 Å/s. | ||
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* Up to 1x6" wafers | * Up to 1x6" wafers | ||
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* III-V materials | * III-V materials | ||
* Silicon wafers | * Silicon wafers | ||
* Quartz wafers | * Quartz wafers | ||
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* Photoresist | * Photoresist | ||
* Metals | * Metals | ||
|-style="background:LightGrey; color:black" | |-style="background:LightGrey; color:black" | ||