Specific Process Knowledge/Thin film deposition/thermalevaporator: Difference between revisions
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[[Image:IMG_2592_edit.jpg|300x300px|thumb| Positioned in cleanroom A-1.]] | [[Image:IMG_2592_edit.jpg|300x300px|thumb| Positioned in cleanroom A-1.]] | ||
The main purpose | The main purpose of the thermal evaporator is to deposit Al for removing charging of the resist when doing EBL on isolating substrate. | ||
It is not only usable for Al deposition. The thermal evaporator has room for two boats and thereby the possibility to make | It is not only usable for Al deposition. The thermal evaporator has room for two boats and thereby the possibility to make thin films of two different metals. At the moment not that many metals have been tested and made a recipe for. Right now it is only Al and Ag that can be used. We have also attempted to evaporate Zn but this was not so easy, so it is not a standard process. If you would like to deposit other metals, please talk to the Thin Film group. | ||
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|style="background:LightGrey; color:black"|Deposition rate | |style="background:LightGrey; color:black"|Deposition rate | ||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black"| | ||
*0.5 Å/s - 5 Å/s (material | *0.5 Å/s - 5 Å/s (material dependent) | ||
|- | |- | ||
!style="background:silver; color:black" align="left" valign="top" rowspan="2"|Process parameter range | !style="background:silver; color:black" align="left" valign="top" rowspan="2"|Process parameter range | ||
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|style="background:LightGrey; color:black"|Process pressure | |style="background:LightGrey; color:black"|Process pressure | ||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black"| | ||
* | * Below 4*10<sup>-6</sup> mbar | ||
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!style="background:silver; color:black" align="left" valign="top" rowspan="3"|Substrates | !style="background:silver; color:black" align="left" valign="top" rowspan="3"|Substrates | ||
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'''*''' ''For thicknesses above | '''*''' ''For thicknesses above 300 nm, please request permission.'' |
Revision as of 15:16, 5 July 2018
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Thermal evaporator- A system for deposition of metals
The main purpose of the thermal evaporator is to deposit Al for removing charging of the resist when doing EBL on isolating substrate.
It is not only usable for Al deposition. The thermal evaporator has room for two boats and thereby the possibility to make thin films of two different metals. At the moment not that many metals have been tested and made a recipe for. Right now it is only Al and Ag that can be used. We have also attempted to evaporate Zn but this was not so easy, so it is not a standard process. If you would like to deposit other metals, please talk to the Thin Film group.
The user manual, APV, technical information and contact information can be found in LabManager:
Thermal Evaporator in LabManager
Process information
Materials for thermal evaporator evaporation
Purpose | Deposition of metals |
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Performance | Film thickness |
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Deposition rate |
| |
Process parameter range | Process Temperature |
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Process pressure |
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Substrates | Batch size |
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Substrate material allowed |
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Material allowed on the substrate |
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* For thicknesses above 300 nm, please request permission.