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Specific Process Knowledge/Thin film deposition/thermalevaporator: Difference between revisions

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[[Image:IMG_2592_edit.jpg|300x300px|thumb| Positioned in cleanroom A-1.]]
[[Image:IMG_2592_edit.jpg|300x300px|thumb| Positioned in cleanroom A-1.]]


The main purpose for the thermal evaporator is to deposit Al for removing charging of the resist when doing EBL on isolating substrate.
The main purpose of the thermal evaporator is to deposit Al for removing charging of the resist when doing EBL on isolating substrate.
   
   
It is not only usable for Al deposition. The thermal evaporator has room for two boats and thereby the possibility to make thinfilms of two different metals. At the moment not that many metals have been test and made a recipe for. Right now is is only Al and Ag that can be used.   
It is not only usable for Al deposition. The thermal evaporator has room for two boats and thereby the possibility to make thin films of two different metals. At the moment not that many metals have been tested and made a recipe for. Right now it is only Al and Ag that can be used. We have also attempted to evaporate Zn but this was not so easy, so it is not a standard process.  If you would like to deposit other metals, please talk to the Thin Film group.




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|style="background:LightGrey; color:black"|Deposition rate
|style="background:LightGrey; color:black"|Deposition rate
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*0.5 Å/s - 5 Å/s (material dependens)
*0.5 Å/s - 5 Å/s (material dependent)
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!style="background:silver; color:black" align="left" valign="top" rowspan="2"|Process parameter range
!style="background:silver; color:black" align="left" valign="top" rowspan="2"|Process parameter range
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|style="background:LightGrey; color:black"|Process pressure
|style="background:LightGrey; color:black"|Process pressure
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|style="background:WhiteSmoke; color:black"|
* Low than 4*10<sup>-6</sup> mbar
* Below 4*10<sup>-6</sup> mbar
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!style="background:silver; color:black" align="left" valign="top" rowspan="3"|Substrates
!style="background:silver; color:black" align="left" valign="top" rowspan="3"|Substrates
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'''*''' ''For thicknesses above 200 nm permission is requested.''
'''*''' ''For thicknesses above 300 nm, please request permission.''
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