Specific Process Knowledge/Thin film deposition/thermalevaporator: Difference between revisions

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[[Image:IMG_2592_edit.jpg|300x300px|thumb| Positioned in cleanroom A-1.]]
[[Image:IMG_2592_edit.jpg|300x300px|thumb| Positioned in cleanroom A-1.]]


The main purpose for the thermal evaporator is to deposit Al for removing charging of the resist when doing EBL on isolating substrate.
The main purpose of the thermal evaporator is to deposit Al for removing charging of the resist when doing EBL on isolating substrate.
   
   
It is not only usable for Al deposition. The thermal evaporator has room for two boats and thereby the possibility to make thinfilms of two different metals. At the moment not that many metals have been test and made a recipe for. Right now is is only Al and Ag that can be used.   
It is not only usable for Al deposition. The thermal evaporator has room for two boats and thereby the possibility to make thin films of two different metals. At the moment not that many metals have been tested and made a recipe for. Right now it is only Al and Ag that can be used. We have also attempted to evaporate Zn but this was not so easy, so it is not a standard processIf you would like to deposit other metals, please talk to the Thin Film group.




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|style="background:LightGrey; color:black"|Deposition rate
|style="background:LightGrey; color:black"|Deposition rate
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*0.5 Å/s - 5 Å/s (material dependens)
*0.5 Å/s - 5 Å/s (material dependent)
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!style="background:silver; color:black" align="left" valign="top" rowspan="2"|Process parameter range
!style="background:silver; color:black" align="left" valign="top" rowspan="2"|Process parameter range
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|style="background:LightGrey; color:black"|Process pressure
|style="background:LightGrey; color:black"|Process pressure
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|style="background:WhiteSmoke; color:black"|
* Low than 4*10<sup>-6</sup> mbar
* Below 4*10<sup>-6</sup> mbar
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!style="background:silver; color:black" align="left" valign="top" rowspan="3"|Substrates
!style="background:silver; color:black" align="left" valign="top" rowspan="3"|Substrates
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'''*''' ''For thicknesses above 200 nm permission is requested.''
'''*''' ''For thicknesses above 300 nm, please request permission.''

Revision as of 15:16, 5 July 2018

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Thermal evaporator- A system for deposition of metals

Positioned in cleanroom A-1.

The main purpose of the thermal evaporator is to deposit Al for removing charging of the resist when doing EBL on isolating substrate.

It is not only usable for Al deposition. The thermal evaporator has room for two boats and thereby the possibility to make thin films of two different metals. At the moment not that many metals have been tested and made a recipe for. Right now it is only Al and Ag that can be used. We have also attempted to evaporate Zn but this was not so easy, so it is not a standard process. If you would like to deposit other metals, please talk to the Thin Film group.


The user manual, APV, technical information and contact information can be found in LabManager:

Thermal Evaporator in LabManager


Process information

Materials for thermal evaporator evaporation

Equipment performance and process related parameters

Purpose Deposition of metals
  • Thermal evaporation of metals
Performance Film thickness
  • 10Å - 1µm* (for some materials)
Deposition rate
  • 0.5 Å/s - 5 Å/s (material dependent)
Process parameter range Process Temperature
  • Approximately room temperature
Process pressure
  • Below 4*10-6 mbar
Substrates Batch size
  • Up to 8" wafer
  • Or several smaller pieces
  • Deposition on one side of the substrate
Substrate material allowed
  • Silicon wafers
  • Quartz wafers
  • Pyrex wafers
Material allowed on the substrate
  • Silicon oxide
  • Silicon (oxy)nitride
  • Photoresist
  • PMMA
  • Mylar
  • Metals

* For thicknesses above 300 nm, please request permission.