Specific Process Knowledge/Thin film deposition/thermalevaporator: Difference between revisions

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Thermal evaporator- A system for deposition of metals

The main purpose for the thermal evaporator is to deposit Al for removing charging of the resist when doing EBL on isolating substrate.

It is not only usable for Al deposition. The thermal evaporator has room for two boats and thereby the possibility to make thinfilms of two different metals. At the moment not that many metals have been test and made a recipe for. Right now is is only Al and Ag that can be used.

The user manual, APV, technical information and contact information can be found in LabManager:

Thermal Evaporator in LabManager

Process information

Materials for thermal evaporator evaporation

Equipment performance and process related parameters

Purpose	Deposition of metals	Thermal evaporation of metals
Performance	Film thickness	10Å - 1µm* (for some materials)
Performance	Deposition rate	0.5 Å/s - 5 Å/s (material dependens)
Process parameter range	Process Temperature	Approximately room temperature
Process parameter range	Process pressure	Low than 4*10^-6 mbar
Substrates	Batch size	Up to 8" wafer Or several smaller pieces Deposition on one side of the substrate
	Substrate material allowed	Silicon wafers Quartz wafers Pyrex wafers
	Material allowed on the substrate	Silicon oxide Silicon (oxy)nitride Photoresist PMMA Mylar Metals

* For thicknesses above 200 nm permission is requested.

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 !style="background:silver; color:black;" align="left"|Purpose
-|style="background:LightGrey; color:black"|Deposition of metals and silicon ||style="background:WhiteSmoke; color:black"|
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 *Thermal evaporation of metals
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