Specific Process Knowledge/Thin film deposition: Difference between revisions
Line 101: | Line 101: | ||
|style="background: #DCDCDC"| | |style="background: #DCDCDC"| | ||
*[[/ALD Picosun R200|ALD Picosun R200]] - Atomic Layer Deposition | *[[/ALD Picosun R200|ALD Picosun R200]] - Atomic Layer Deposition | ||
*[[/ALD2 (PEALD)| | *[[/ALD2 (PEALD)|ALD2 (PEALD)]] - Plasma Enhance Atomic Layer Deposition | ||
|style="background: LightGray"| | |style="background: LightGray"| | ||
See the [[Specific Process Knowledge/Lithography/Coaters |Lithography/Coaters]] page for coating polymers | See the [[Specific Process Knowledge/Lithography/Coaters |Lithography/Coaters]] page for coating polymers |
Revision as of 13:07, 13 March 2017
Feedback to this page: click here
Choose material to deposit
Dielectrica | Semicondutors | Metals | Alloys | Transparent conductive oxides | Polymers |
Silicon Nitride - and oxynitride |
Aluminium |
TiW alloy (10%/90% by weight) |
ITO (Tin doped Indium Oxide) |
SU-8 |
Choose deposition equipment
PVD | LPCVD | PECVD | ALD | Coaters | Others
|
|
|
|
|
See the Lithography/Coaters page for coating polymers |
|