Specific Process Knowledge/Thin film deposition: Difference between revisions

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*[[/Sputter coater#The_Balzer_Sputter_coater|Balzer Sputter coater]] -<span style="color:Red"> (Decommissioned</span>) ''Gold sputtering system''
*[[/Sputter coater#The_Balzer_Sputter_coater|Balzer Sputter coater]] -<span style="color:Red"> (Decommissioned</span>) ''Gold sputtering system''
*[[/Sputter coater#Sputter_coater 03|Sputter coater 03]] - ''Gold sputtering system''
*[[/Sputter coater#Sputter_coater 03|Sputter coater 03]] - ''Gold sputtering system''
*[[/Sputter coater#Sputter_coater 04|Sputter coater 04]] - ''Gold sputtering system''
*[[/III-V Dielectric evaporator|III-V Dielectric evaporator]] - ''E-beam evaporation tool''
*[[/III-V Dielectric evaporator|III-V Dielectric evaporator]] - ''E-beam evaporation tool''
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Revision as of 14:31, 6 February 2017

3rd Level - Material/Method

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Choose material to deposit

Dielectrica Semicondutors Metals Alloys Transparent conductive oxides Polymers

Silicon Nitride - and oxynitride
Silicon Oxide
Titania (TiO2, Titanium Oxide)
Alumina (Al2O3, Aluminium Oxide)
Aluminum Nitride (AlxNy)
Tantalum (Ta2O5, Tantalum pentoxide)
Cromia (Cr2O3, Chromium Oxide)

Silicon
Germanium
Zinc Oxide (ZnO)

Aluminium
Titanium
Chromium
Cobalt
Nickel
Copper
Molybdenum
Palladium
Silver
Tin
Tantalum
Tungsten
Platinum
Gold
Iron
Magnesium
Niobium
Ruthenium

TiW alloy (10%/90% by weight)
NiV alloy
AlCu
CoFe
CuTi
FeMn
MnIr
NiCo
NiFe
YSZ (Yttrium stabilized Zirconium)

ITO (Tin doped Indium Oxide)
AZO (Aluminum doped Zinc Oxide)

SU-8
Antistiction coating
Topas
PMMA

Choose deposition equipment

PVD LPCVD PECVD ALD Coaters Others


See the Lithography/Coaters page for coating polymers