Specific Process Knowledge/Thin film deposition: Difference between revisions

Revision as of 10:54, 12 May 2016

3rd Level - Material/Method

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Dielectrica	Semicondutors	Metals	Alloys	Transparent conductive oxides	Polymers
Silicon Nitride - and oxynitride Silicon Oxide Titania (TiO₂, Titanium Oxide) Alumina (Al₂O₃, Aluminium Oxide) Aluminum Nitride (Al_xN_y) Tantalum (Ta₂O₅, Tantalum pentoxide) Cromia (Cr₂O₃, Chromium Oxide)	Silicon Germanium Zinc Oxide (ZnO)	Aluminium Titanium Chromium Cobalt Nickel Copper Molybdenum Palladium Silver Tin Tantalum Tungsten Platinum Gold Iron Magnesium Niobium Ruthenium	TiW alloy (10%/90% by weight) NiCr alloy AlTi alloy NiV alloy MgB AlCu CoFe CuTi FeMn MnIr NiCo NiFe YSZ (Yttrium stabilized Zirconium)	ITO (Tin doped Indium Oxide) AZO (Aluminum doped Zinc Oxide	SU-8 Antistiction coating Topas PMMA

PVD	LPCVD	PECVD	ALD	Coaters	Others
Alcatel - E-beam evaporator and sputter tool Lesker - Sputter tool PVD co-sputter/evaporation - (will be decommissioned soon) E-beam evaporator and multiple wafer tool Wordentec - E-beam evaporator, sputter and thermal evaporator Physimeca - E-beam evaporator (III-V lab) IBE/IBSD Ionfab 300 - Sputter deposition of high quality optical layers and milling/etching Sputter coater Hummer - Gold sputtering system Balzer Sputter coater - Gold sputtering system III-V Dielectric evaporator - E-beam evaporation tool	Furnace LPCVD Nitride (4" and 6") - Deposition of silicon nitride Furnace LPCVD Polysilicon (4" and 6") Deposition of polysilicon Furnace LPCVD TEOS (4") - Deposition of silicon oxide	PECVD - Plasma Enhanced Chemical Vapor deposition Black Magic PECVD - Black Magic PECVD (Carbon)	ALD Picosun R200 - Atomic layer deposition	See the Lithography/Coaters page for coating polymers	MVD - Molecular Vapor Deposition Electroplating-Ni - Electrochemical deposition of nickel Electroplating-Cu - Electrochemical deposition of copper MOCVD - Epitaxial growth - Ask the department of photonics if you are interested: Elizaveta Semenova or Kresten Yvind

@@ Line 86: / Line 86: @@
 *[[/Alcatel|Alcatel]] - ''E-beam evaporator and sputter tool''
 *[[/Lesker|Lesker]] - ''Sputter tool''
-*[[/Multisource_PVD|PVD co-sputter/evaporation]] - ''E-beam evaporator and multiple wafer tool''
+*[[/Multisource_PVD|PVD co-sputter/evaporation]] - <span style="color:Red"> (will be decommissioned soon</span>) ''E-beam evaporator and multiple wafer tool''
 *[[/Wordentec|Wordentec]] - ''E-beam evaporator, sputter and thermal evaporator''
 *[[/Physimeca|Physimeca]] - ''E-beam evaporator (III-V lab)''