Specific Process Knowledge/Thin film deposition/Lesker: Difference between revisions
| Line 78: | Line 78: | ||
|style="background:LightGrey; color:black"|Batch size | |style="background:LightGrey; color:black"|Batch size | ||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black"| | ||
*4" | *chips | ||
*4" | |||
*6" | |||
|- | |- | ||
| style="background:LightGrey; color:black"|Substrate material allowed | | style="background:LightGrey; color:black"|Substrate material allowed | ||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black"| | ||
*Silicon wafers | *Silicon wafers | ||
* | *and almost any other | ||
|- | |- | ||
| style="background:LightGrey; color:black"|Material allowed on the substrate | | style="background:LightGrey; color:black"|Material allowed on the substrate | ||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black"| | ||
* | *almost any | ||
|- | |- | ||
|} | |} | ||